Datasheet Texas Instruments AM5706ACBDJEA — 数据表

制造商Texas Instruments
系列AM5706
零件号AM5706ACBDJEA

Sitara处理器538-FCBGA -40至105

数据表

AM570x Sitaraв„ў Processors datasheet
PDF, 3.7 Mb, 修订版: A, 档案已发布: Feb 16, 2017
从文件中提取

价格

状态

Lifecycle StatusPreview (Device has been announced but is not in production. Samples may or may not be available)
Manufacture's Sample AvailabilityNo

打包

Pin538
Package TypeCBD
Width (mm)17
Length (mm)17
Thickness (mm).878
Mechanical Data下载

参数化

ARM CPU1 ARM Cortex-A15
ARM MHz (Max.)500
1000
ARM MIPS(Max.)1750
3500
ApplicationCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
CAN(#)2
CSI-21
Co-Processor(s)2 ARM Cortex-M4
4 PRU-ICSS
DMA(Ch)64-Ch EDMA
DRAMDDR3(L)
DSP1 C66x
DSP MHz (Max.)500
750
EMAC10/100/1000
2-Port 1Gb Switch
General Purpose Memory1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
I2C5
IO Supply(V)1.8
3.3
Industrial Protocols1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
MMC/SD4
McASP8
On-Chip L1 Cache32 KB (ARM Cortex-A15)
32 KB (C66x)
On-Chip L2 Cache1 MB w/ECC (ARM Cortex-A15)
288 KB (C66x)
Operating SystemsAndroid
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Operating Temperature Range(C)-40 to 105
Other Hardware AccelerationCrypto Accelerator
Other On-Chip Memory512 KB w/ECC
PCI/PCIe2 PCIe
PWM(Ch)3
Package GroupFCBGA
QSPI1
RatingCatalog
SPI4
Security EnablerCryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Serial I/OCAN
I2C
SPI
UART
USB
UART(SCI)10
USB2
USB 2.01
USB 3.01
Video Port (Configurable)4
eCAP3
eQEP3

生态计划

RoHSNot Compliant
Pb FreeNo

设计套件和评估模块

  • Development Kits: TMDXIDK5718
    AM571x Industrial Development Kit (IDK)
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSEVM572X
    AM572x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSCM572X
    TMDSEVM572x Camera Module
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: TMDXIDK57X-LCD
    AM57x IDK LCD Kit
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU110-U
    XDS110 JTAG Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • DSPLIB for Processor SDK RTOS
    PDF, 461 Kb, 档案已发布: Nov 4, 2016
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
  • Code Composer Studio Device Support Package
    PDF, 87 Kb, 档案已发布: Nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, 档案已发布: Oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • EMIF Tools (Rev. A)
    PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • Keystone EDMA FAQ
    PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: AM5706 (2)

制造商分类

  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x