Datasheet Texas Instruments AM5706 — 数据表

数据表

价格

状态

打包

参数化

Parameters / Models	AM5706ACBDJEA	XAM5706ACBDJEA
ARM CPU	1 ARM Cortex-A15	1 ARM Cortex-A15
ARM MHz, Max.		500,1000
ARM MHz (Max.)	500 1000
ARM MIPS, Max.		1750,3500
ARM MIPS(Max.)	1750 3500
Application	Communications Equipment Enterprise Systems Industrial Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
CAN		2
CAN(#)	2
CSI-2	1	1
Co-Processor, s		2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)	2 ARM Cortex-M4 4 PRU-ICSS
DMA, Ch		64-Ch EDMA
DMA(Ch)	64-Ch EDMA
DRAM	DDR3(L)	DDR3,DDR3L
DSP	1 C66x	1 C66x
DSP MHz, Max.		500,750
DSP MHz (Max.)	500 750
EMAC	10/100/1000 2-Port 1Gb Switch	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory	1 16-bit (GPMC NAND flash NOR Flash SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
I2C	5	5
IO Supply, V		1.8,3.3
IO Supply(V)	1.8 3.3
Industrial Protocols	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
MMC/SD	4	4
McASP	8	8
On-Chip L1 Cache	32 KB (ARM Cortex-A15) 32 KB (C66x)	32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache	1 MB w/ECC (ARM Cortex-A15) 288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating Systems	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C		-40 to 105
Operating Temperature Range(C)	-40 to 105
Other Hardware Acceleration	Crypto Accelerator	Crypto Accelerator
Other On-Chip Memory	512 KB w/ECC	512 KB w/ECC
PCI/PCIe	2 PCIe	2 PCIe
PWM, Ch		3
PWM(Ch)	3
Package Group	FCBGA	FCBGA
QSPI	1	1
Rating	Catalog	Catalog
SPI	4	4
Security Enabler	Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment
Serial I/O	CAN I2C SPI UART USB	CAN,I2C,SPI,UART,USB
UART, SCI		10
UART(SCI)	10
USB	2	2
USB 2.0	1	1
USB 3.0	1	1
Video Port, Configurable		4
Video Port (Configurable)	4
eCAP	3	3
eQEP	3	3

生态计划

应用须知

• 下载
  DSPLIB for Processor SDK RTOS
  PDF, 461 Kb, 档案已发布: Nov 4, 2016
• 下载
  IODELAY Application Note for AM57xx Devices (Rev. A)
  PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
• 下载
  Code Composer Studio Device Support Package
  PDF, 87 Kb, 档案已发布: Nov 19, 2015
  This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
• 下载
  AM572x/AM571x Compatibility Guide (Rev. C)
  PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
  This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
• 下载
  AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
  PDF, 55 Kb, 档案已发布: Oct 6, 2016
  When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
• 下载
  EMIF Tools (Rev. A)
  PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
• 下载
  Keystone EDMA FAQ
  PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
  This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
• 下载
  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
• 下载
  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• 下载
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• 下载
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
• 下载
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

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制造商分类

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x