Datasheet Texas Instruments X66AK2G01ZBB60 — 数据表

制造商Texas Instruments
系列66AK2G01
零件号X66AK2G01ZBB60
Datasheet Texas Instruments X66AK2G01ZBB60

多核DSP + ARM KeyStone II片上系统(SoC)625-NFBGA 0至70

数据表

66AK2G0x Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.6 Mb, 修订版: E, 档案已发布: Jun 8, 2017
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin625
Package TypeZBB
Package QTY1
CarrierJEDEC TRAY (5+1)
Width (mm)21
Length (mm)21
Thickness (mm)1.16
Mechanical Data下载

参数化

ARM CPU1 ARM Cortex-A15
ARM MHz600 Max.
ApplicationsCommunications and Telecom,Consumer Electronics,Industrial,Test and Measurement
DRAMDDR3L
DSP1 C66x
DSP MHz600 Max.
EMAC1-port 1Gb
Hardware AcceleratorsSecurity Accelerator
I2C3
On-Chip L2 Cache512KB w/ECC ARM Cortex-A15,1024KB w/ECC C66x DSP
Operating SystemsLinux,TI-RTOS
Operating Temperature Range0 to 70 C
Other On-Chip Memory1024KB w/ECC
RatingCatalog
SPI4
UART3 SCI
USB1

生态计划

RoHSSee ti.com

设计套件和评估模块

  • Daughter Cards: AUDK2G
    66AK2Gx (K2G) Audio Daughter Card
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMK2G
    66AK2Gx (K2G) Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • 66AK2G02 Power Estimation Tool
    PDF, 27 Kb, 档案已发布: Jun 15, 2017
    This power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the r
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, 档案已发布: Mar 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Processor SDK RTOS Audio Benchmark Starter Kit
    PDF, 530 Kb, 档案已发布: Apr 12, 2017
    The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
  • PRU-ICSS Feature Comparison
    PDF, 29 Kb, 档案已发布: Jun 5, 2017
    This application report documents the feature differences between the PRU subsystems available on different TI processors.
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: 66AK2G01 (1)
  • X66AK2G01ZBB60

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x