Datasheet Texas Instruments XDM3730CBP — 数据表
制造商 | Texas Instruments |
系列 | DM3730 |
零件号 | XDM3730CBP |
![Datasheet Texas Instruments XDM3730CBP](http://www.ti.com/graphics/folders/partimages/DM3730.jpg)
数字媒体处理器515-POP-FCBGA 0至90
数据表
价格
状态
Lifecycle Status | Obsolete (Manufacturer has discontinued the production of the device) |
Manufacture's Sample Availability | No |
打包
Pin | 515 |
Package Type | CBP |
Industry STD Term | POP-FCBGA |
JEDEC Code | S-PBGA-N |
Width (mm) | 12 |
Length (mm) | 12 |
Thickness (mm) | .5 |
Pitch (mm) | .4 |
Max Height (mm) | .7 |
Mechanical Data | 下载 |
参数化
ARM CPU | 1 ARM Cortex-A8 |
ARM MHz (Max.) | 800 1000 |
Applications | Audio Automotive Communications and Telecom Computers and Peripherals Consumer Electronics Energy Industrial Medical Security |
Approx. Price (US$) | 25.60 | 1ku |
DRAM | LPDDR |
DSP | 1 C64x |
DSP MHz (Max.) | 660 800 |
I2C | 4 |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) |
Operating Systems | Android DSP/BIOS Neutrino ntegrity Windows Embedded CE Linux VXWorks |
Operating Temperature Range(C) | -40 to 105 -40 to 90 0 to 90 |
Pin/Package | 423FCBGA 515POP-FCBGA |
Rating | Catalog |
SPI | 4 |
UART(SCI) | 4 |
USB | 4 |
Video Port (Configurable) | 1 Dedicated Input 1 Dedicated Output |
Video Resolution/Frame Rate | D1 or Less 720p |
生态计划
RoHS | Not Compliant |
Pb Free | No |
设计套件和评估模块
- Evaluation Modules & Boards: TMDSEVM3730
AM/DM37x Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BEAGLEXM
BeagleBoard-xM Development Board
Lifecycle Status: Active (Recommended for new designs)
应用须知
- TI OMAP4430 POP SMT Design Guideline (Rev. C)PDF, 3.2 Mb, 修订版: C, 档案已发布: Nov 3, 2011
- AM3715 GPMCPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio - PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUsPDF, 739 Kb, 档案已发布: Jun 15, 2011
The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how - AM3715/03 Memory SubsystemPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr - AM37x/DM37x Schematic ChecklistPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as - AM37x EVM Software Developer's GuidePDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A - AM/DM37x Power Estimation SpreadsheetPDF, 20 Kb, 档案已发布: Jun 7, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high - AM/DM37x OverviewPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective - Ethernet Connectivity via GPMCPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices, - Setting up AM37x SDRC RegistersPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o - AM37x CUS Routing GuidelinesPDF, 19 Kb, 档案已发布: Jun 3, 2010
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part IIPDF, 1.2 Mb, 档案已发布: Jun 23, 2010
Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process - PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part IPDF, 2.0 Mb, 档案已发布: Jun 23, 2010
Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.Fine-pitch PCB design is a team effort and may require more than
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
- Introduction to TMS320C6000 DSP OptimizationPDF, 535 Kb, 档案已发布: Oct 6, 2011
The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then
模型线
系列: DM3730 (15)
制造商分类
- Semiconductors > Processors > Digital Signal Processors > Media Processors > DaVinci Video Processors