Datasheet Texas Instruments AVCE6467TZUTL1 — 数据表

制造商Texas Instruments
系列AVCE6467T
零件号AVCE6467TZUTL1
Datasheet Texas Instruments AVCE6467TZUTL1

数字媒体片上系统529-FCBGA

数据表

VCE6467T, AVCE6467T Digital Media System-on-Chip
PDF, 2.1 Mb, 档案已发布: Mar 4, 2011

价格

状态

Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNo

打包

Pin529529
Package TypeZUTZUT
Industry STD TermFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Device MarkingTMS320AVCE6467TZUTL1
Width (mm)1919
Length (mm)1919
Thickness (mm)2.652.65
Pitch (mm).8.8
Max Height (mm)3.33.3
Mechanical Data下载下载

生态计划

RoHSNot Compliant
Pb FreeNo

设计套件和评估模块

  • Evaluation Modules & Boards: THS8135EVM
    THS8135 Evaluation Module
    Lifecycle Status: NRND (Not recommended for new designs)

应用须知

  • TMS320DM6467T Power Consumption Summary
    PDF, 132 Kb, 档案已发布: Nov 13, 2009
    This application report discusses the power consumption of the Texas Instruments TMS320DM6467T digital media System-on-Chip (DMSoC). Power consumption on the DM6467T device is highly application-dependent; therefore, a spreadsheet that estimates power consumption is provided along with this document. To obtain good results from the spreadsheet, realistic usage parameters must be entered (see Secti
  • Using the TMS320DM646x DMSoC Bootloader (Rev. D)
    PDF, 136 Kb, 修订版: D, 档案已发布: Mar 4, 2011
    This document describes the functionality of the TMS320DM6467 Digital Media System-on-Chip (DMSoC) ARM ROM bootloader (RBL) software. The ARM ROM bootloader resides in the ROM of the device beginning at address 0x00008000. The RBL implements methods for booting in the listed modes and uses boot configuration pins to determine boot mode. If an improper boot mode is chosen, or an error is detected d
  • TMS320DM6467 to TMS320DM6467T Migration Guide (Rev. B)
    PDF, 40 Kb, 修订版: B, 档案已发布: Jun 8, 2010
    This application report describes an overview of the necessary changes to migrate a DM6467-based design from a DM6467 device (594 MHz or 729 MHz) to a DM6467T (1GHz) device. The DM6467T device requires the changes listed in this document for proper operation. Other system changes may be required to accommodate new speeds or capabilities in the system.
  • Multiple TMS320DM6467 PCI Interface
    PDF, 85 Kb, 档案已发布: Feb 10, 2009
    The DM6467 contains a PCI interface that allows connecting it to a PCI bus in order to communicate with the other peripherals in the system. The DM6467 PCI has a 32-bit data bus. The operating frequency is specified in the device-specific data sheet. This document shows different ways to interface DM6467 devices with the PCI bus.
  • Using the Video Port of TMS320DM646x (Rev. A)
    PDF, 181 Kb, 修订版: A, 档案已发布: Apr 6, 2010
    This application report has supplemental information about using the DM646x video port. The tips and tricks in this document are useful in video security applications as well as other applications that make use of the video port.
  • PCI Express to TMS320DM646x PCI Interface Through XIO2000A Bridge
    PDF, 119 Kb, 档案已发布: Feb 3, 2009
    The Texas Instruments DM646x devices support interfacing to a peripheral component interconnect (PCI) bus through its PCI port. The system or the application may contain a PCI ExpressВ® interface. In order to connect the PCI Express bus to the DM646x PCI bus, an XIO2000A translation bridge is used. XIO2000A is a PCI Express to PCI/PCI-Xв„ў bus translation bridge.
  • Building a Small Embedded Linux Kernel Example (Rev. A)
    PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
    Building a Small Embedded Linux Kernel Example Application Report
  • Running a TMS320C64x+ Codec Across TMS320C64x+ Based DSP Platforms
    PDF, 969 Kb, 档案已发布: Sep 24, 2009
    This application report describes the device differences to be taken care for running the C64x+™ video codec software on different C64x+ based platforms. This document assumes that the codec software is developed for the C64x+ digital signal processor (DSP) core. As many TI platforms have a C64x+ DSP this document gives the details for running the standalone codec software on a C64x+ platfo
  • Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
    PDF, 126 Kb, 修订版: B, 档案已发布: Jul 7, 1999
    Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
  • AVC Logic Family Technology and Applications (Rev. A)
    PDF, 148 Kb, 修订版: A, 档案已发布: Aug 26, 1998
    Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, 修订版: B, 档案已发布: Apr 30, 2015
  • Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
    PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
    This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
  • Thermal Considerations for the DM64xx, DM64x, and C6000 Devices
    PDF, 127 Kb, 档案已发布: May 20, 2007
    As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
  • TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A)
    PDF, 310 Kb, 修订版: A, 档案已发布: Oct 20, 2005
    This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati

模型线

系列: AVCE6467T (1)
  • AVCE6467TZUTL1

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > Media Processors > DaVinci Video Processors