Datasheet Texas Instruments TMS320C6727BZDH250 — 数据表

制造商Texas Instruments
系列TMS320C6727
零件号TMS320C6727BZDH250
Datasheet Texas Instruments TMS320C6727BZDH250

浮点数字信号处理器256-BGA

数据表

TMS320C6727, TMS320C6726, TMS320C6722 Floating-Point Digital Signal Processors datasheet
PDF, 1.1 Mb, 修订版: E, 档案已发布: Jan 5, 2007
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin256256256
Package TypeZDHZDHZDH
Industry STD TermBGABGABGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY909090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking320C6727BZDHTMS250
Width (mm)171717
Length (mm)171717
Thickness (mm)1.411.411.41
Pitch (mm)111
Max Height (mm)2.022.022.02
Mechanical Data下载下载下载

参数化

DSP1 C67x
RatingCatalog

生态计划

RoHSCompliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • C9230C100 TMS320C672x Floating-Point Digital Signal Processor ROM (Rev. C)
    PDF, 60 Kb, 修订版: C, 档案已发布: Sep 25, 2006
    Describes the features of the C9230C100 TMS320C672x digital signal processor ROM. The system level patch, bootloader utilities and example code, can be downloaded from this link: http://www-s.ti.com/sc/psheets/sprc203/sprc203.zip.
  • How to Create Delay-based Audio Effects on a TMS320C6727 DSP
    PDF, 600 Kb, 档案已发布: Nov 1, 2005
    TMS320C672x is a floating point device family from Texas Instruments that provides high quality audio performance at low prices. The price/performance ratio makes C672x well suited for numerous audio applications. This application note shows how to use C672x to efficiently create delay-based audio effects. The application note explains:How to leverage the data movement accelerator (dM
  • Using the TMS320C672x Bootloader (Rev. D)
    PDF, 456 Kb, 修订版: D, 档案已发布: Sep 10, 2009
    This application report describes the design details of the TMS320C672x bootloader and describes a set of software utilities designed to facilitate formatting of application code for use with the bootloader.This application report contains a system level patch, the bootloader utilities and project code that can bedownloaded from this link:
  • Using ROM Contents on TMS320C672x
    PDF, 92 Kb, 档案已发布: Feb 5, 2008
    This application report explains how to configure an application based on pure software libraries and routines and how to properly use the provided ROM contents for the TMS320C672x DSP generation of devices. Several software examples are provided, explaining the process in progressive steps.
  • TMS320C672x Power Consumption Summary (Rev. B)
    PDF, 55 Kb, 修订版: B, 档案已发布: Sep 22, 2006
    This document discusses the power consumption of the Texas Instruments TMS320C672x digital signal processor (DSP). Power consumption on TMS320C67x™ devices is highly application-dependent. A spreadsheet is provided to model power consumption for the user’s application. To get good results from the spreadsheet, realistic usage parameters must be entered. The low-core voltage and other power d
  • TMS320C6713 to TMS320C672x Migration Guide
    PDF, 182 Kb, 档案已发布: May 23, 2005
  • TMS320C672x Hardware Designer's Resource Guide (Rev. A)
    PDF, 87 Kb, 修订版: A, 档案已发布: Sep 22, 2006
    The DSP Hardware Designer's Resource Guide is organized by development flow and functional areas to make your design effort as seamless as possible. Topics covered include getting started, board design, system testing, and checklists to aid in your initial design and debug efforts. Each section includes pointers to valuable information including technical documentation, models, symbols, and refere
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • Thermal Considerations for the DM64xx, DM64x, and C6000 Devices
    PDF, 127 Kb, 档案已发布: May 20, 2007
    As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices.
  • Common Object File Format (COFF)
    PDF, 125 Kb, 档案已发布: Apr 15, 2009

模型线

系列: TMS320C6727 (3)

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP > Other C6000 DSP