Data sheet acquired from Harris Semiconductor
SCHS074A – Revised June 2003 The CD4514B and CD4515B types are supplied
in 16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic packages (E suffix), and 16-lead
small-outline packages (M and M96 suffixes). Copyright пЈ© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2016 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) 7703201JA ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 7703201JA
CD4515BF3A CD4514BF ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4514BF CD4514BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4514BF3A CD4514BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4514BM CD4514BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4514BM CD4514BM96E4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4514BM CD4514BM96G4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4514BM CD4515BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 7703201JA
CD4515BF3A CD4515BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4515BM CD4515BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4515BM CD4515BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4515BM (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. …
