Datasheet Texas Instruments OMAPL138BGWTMEP — 数据表

制造商Texas Instruments
系列OMAPL138B-EP
零件号OMAPL138BGWTMEP
Datasheet Texas Instruments OMAPL138BGWTMEP

增强型产品低功耗应用处理器361-NFBGA -55至125

数据表

OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, 修订版: C, 档案已发布: Apr 12, 2013
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin361361361
Package TypeGWTGWTGWT
Industry STD TermNFBGANFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY909090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingGWTMEP21OMAPL138B
Width (mm)161616
Length (mm)161616
Thickness (mm).9.9.9
Pitch (mm).8.8.8
Max Height (mm)1.41.41.4
Mechanical Data下载下载下载

参数化

ARM CPU1 ARM9
ARM MHz345 Max.
ApplicationsCommunications and Telecom,Energy,Industrial,Medical
DRAMLPDDR,DDR2
DSP1 C674x
DSP MHz345 Max.
Display Options1
EMAC10/100
I2C2
On-Chip L2 Cache256 KB (DSP)
Operating SystemsLinux,SYS/BIOS
Operating Temperature Range-55 to 125 C
Other On-Chip Memory128 KB
RatingHiRel Enhanced Product
SPI2
UART3 SCI
USB2
Video Port1 Configurable

生态计划

RoHSSee ti.com

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • Processor SDK RTOS Audio Benchmark Starter Kit
    PDF, 530 Kb, 档案已发布: Apr 12, 2017
    The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015

模型线

系列: OMAPL138B-EP (2)

制造商分类

  • Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor