Datasheet Texas Instruments OMAPL138BGWTMEP — 数据表

增强型产品低功耗应用处理器361-NFBGA -55至125

数据表

PDF, 1.8 Mb, 修订版: C, 档案已发布: Apr 12, 2013

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nFBGA Packaging (Rev. B)
PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
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Processor SDK RTOS Audio Benchmark Starter Kit
PDF, 530 Kb, 档案已发布: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
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0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
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Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015

系列: OMAPL138B-EP (2)

Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor