Datasheet Texas Instruments LM2577T-12/LB03 — 数据表

制造商Texas Instruments
系列LM2577
零件号LM2577T-12/LB03
Datasheet Texas Instruments LM2577T-12/LB03

SIMPLESWITCHERВ®3.5V至40V,3A低组件数升压稳压器5-TO-220

数据表

LM1577/LM2577 SIMPLE SWITCHER Step-Up Voltage Regulator datasheet
PDF, 4.0 Mb, 修订版: D, 档案已发布: Apr 3, 2013
从文件中提取

价格

状态

Lifecycle StatusNRND (Not recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin55
Package TypeNDHNDH
Industry STD TermTO-220TO-220
JEDEC CodeR-MSFM-LR-MSFM-L
Device MarkingP+LM2577T-12
Width (mm)10.1610.16
Length (mm)14.98614.986
Thickness (mm)4.5724.572
Pitch (mm)1.7021.702
Max Height (mm)4.74.7
Mechanical Data下载下载

替代品

ReplacementLM2577T-ADJ/NOPB
Replacement CodeQ

参数化

Approx. Price (US$)2.65 | 1ku
Duty Cycle(Max)(%)95
Iq(Typ)(mA)10
Operating Temperature Range(C)-40 to 125
Package GroupTO-220
RatingCatalog
Regulated Outputs(#)1
Switch Current Limit(Typ)(A)3
Switching Frequency(Max)(kHz)52
Switching Frequency(Min)(kHz)52
TypeConverter
Vin(Max)(V)40
Vin(Min)(V)3.5
Vout(Max)(V)15
Vout(Min)(V)1.23

生态计划

RoHSNot Compliant
Pb FreeNo

应用须知

  • AN-777 LM2577 Three Output, Isolated Flyback Regulator (Rev. B)
    PDF, 278 Kb, 修订版: B, 档案已发布: Apr 23, 2013
    Many voltage regulator applications require multiple outputs, such as a computer's power supply or aregulator used to meet the voltage requirements inside an automobile. Some of these applications requireisolation between the regulator's input and output for protection and separate ground specifications. Usingthese criteria, a LM2577 simple switcher flyback regulator has been designed with m
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • AN-776 20-W SIMPLE SWITCHER Forward Converter (Rev. A)
    PDF, 593 Kb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note provides information about the 20-watt simple switcher forward converter.
  • Working With Boost Converters
    PDF, 159 Kb, 档案已发布: Jun 15, 2015
    This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
  • Input and Output Capacitor Selection
    PDF, 219 Kb, 档案已发布: Sep 19, 2005
  • Basic Calculation of a Boost Converter's Power Stage (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jan 8, 2014
    This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
  • Negative Buck Switching Regulator (using LM258x)
    PDF, 122 Kb, 档案已发布: Mar 21, 2007
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • Understanding Boost Power Stages In Switchmode Power Supplies
    PDF, 149 Kb, 档案已发布: Mar 4, 1999
    A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
  • Switching Regulator Fundamentals (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Sep 23, 2016
    Theswitchingregulatoris increasingin popularitybecauseit offersthe advantagesof higherpowerconversionefficiencyand increaseddesignflexibility(multipleoutputvoltagesof differentpolaritiescan begeneratedfroma singleinputvoltage).

模型线

制造商分类

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Up (Boost) > Boost Converter (Integrated Switch)

其他名称:

LM2577T12/LB03, LM2577T 12/LB03