Datasheet Texas Instruments 66AK2L06XCMSA — 数据表

制造商Texas Instruments
系列66AK2L06
零件号66AK2L06XCMSA
Datasheet Texas Instruments 66AK2L06XCMSA

多核DSP + ARM KeyStone II片上系统(SoC)900-FCBGA -40至100

数据表

66AK2L06 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 1.9 Mb, 档案已发布: Apr 21, 2015
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin900900900
Package TypeCMSCMSCMS
Package QTY444444
Device MarkingA1GHZ@201366AK2L06XCMS
Width (mm)252525
Length (mm)252525
Thickness (mm)2.982.982.98
Mechanical Data下载下载下载

参数化

ARM CPU2 ARM Cortex-A15
ARM MHz1200 Max.
ApplicationsAvionics and Defense,Medical,Test and Measurement
DRAMDDR3,DDR3L
DSP4 C66x
DSP MHz1200 Max.
EMAC4-port 1Gb Switch
Hardware AcceleratorsFFT Coprocessor,Digital Front End
I2C3
JESD204B4 Lanes
On-Chip L2 Cache1024 KB (ARM Cluster),1024 KB (per C66x DSP core)
Operating SystemsIntegrity,Linux,SYS/BIOS,VxWorks
Operating Temperature Range-40 to 100,0 to 100 C
Other On-Chip Memory3072 KB
PCI/PCIe2 PCIe Gen2
RatingCatalog
SPI3
UART4 SCI
USB1

生态计划

RoHSCompliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: XEVMK2LX
    66AK2L06 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • TPS544Bxx/TPS544Cxx Powering TCI6630K2L in Smart Reflex Class 0 TC Mode
    PDF, 154 Kb, 档案已发布: Sep 18, 2015
    This application report describes an application circuit example of the TPS544B/Cxx family of power management IC (PMIC) powering the Smart-Reflex digital core supply of the TCI6630K2L SoC. Smart-Reflex Class 0 Temperature Compensation (Class 0 TC) mode of operation of the TCI6630K2L device is emphasized. Assumption is that temperature compensation mode is enabled using the function provided in th
  • 66AK2L06 JESD Attach to ADC12J4000/DAC38J84 Getting Started Guide (Rev. B)
    PDF, 8.8 Mb, 修订版: B, 档案已发布: Jun 20, 2016
  • Keystone EDMA FAQ
    PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • System solution for avionics & defense
    PDF, 1.2 Mb, 档案已发布: Sep 23, 2015
  • Keystone II DDR3 Initialization
    PDF, 73 Kb, 档案已发布: Jan 26, 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Kb, 修订版: C, 档案已发布: Jul 15, 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Kb, 修订版: B, 档案已发布: Dec 22, 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Kb, 档案已发布: Oct 16, 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, 档案已发布: Mar 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, 档案已发布: Dec 13, 2011
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, 档案已发布: Nov 9, 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.

模型线

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x