Datasheet Texas Instruments LM2673S-3.3/NOPB — 数据表

制造商	Texas Instruments
系列	LM2673
零件号	LM2673S-3.3/NOPB

具有可调限流功能的3A降压稳压器7-DDPAK / TO-263 -40至125

数据表

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PDF, 2.2 Mb, 修订版: O, 档案已发布: Jun 30, 2016

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价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

打包

Pin	7	7
Package Type	KTW	KTW
Industry STD Term	TO-263	TO-263
JEDEC Code	R-PSFM-G	R-PSFM-G
Package QTY	45	45
Carrier	TUBE	TUBE
Device Marking	LM2673	S-3.3
Width (mm)	8.89	8.89
Length (mm)	10.1	10.1
Thickness (mm)	4.44	4.44
Pitch (mm)	1.27	1.27
Max Height (mm)	4.65	4.65
Mechanical Data	下载	下载

参数化

Control Mode	Voltage Mode
Duty Cycle(Max)	91 %
Iout(Max)	3 A
Iq(Typ)	4.2 mA
Operating Temperature Range	-40 to 125 C
Package Group	DDPAK/TO-263
Rating	Catalog
Regulated Outputs	1
Special Features	Enable
Switching Frequency(Max)	260 kHz
Switching Frequency(Min)	260 kHz
Type	Converter
Vin(Max)	40 V
Vin(Min)	8 V
Vout(Max)	37 V
Vout(Min)	1.23 V

生态计划

RoHS	Compliant
Pb Free	Yes

设计套件和评估模块

Evaluation Modules & Boards: LM2673-5.0EVAL
SIMPLE SWITCHERВ® 3A Step-Down Voltage Regulator with Adjustable Current Limit Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
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应用须知

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AN-643 EMI/RFI Board Design (Rev. B)
PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
Application Note 643 EMI/RFI Board Design
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AN-1187 Leadless Leadframe Package (LLP) (Rev. R)
PDF, 21.3 Mb, 修订版: R, 档案已发布: May 7, 2013
This application report discusses the Leadless Leadframe Package (LLP).
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Input and Output Capacitor Selection
PDF, 219 Kb, 档案已发布: Sep 19, 2005
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AN-1197 Selecting Inductors for Buck Converters (Rev. B)
PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
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AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application note provides thermal power analysis techniques for analyzing the power IC.
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AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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Semiconductor and IC Package Thermal Metrics (Rev. C)
PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
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Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
PDF, 512 Kb, 修订版: A, 档案已发布: Sep 12, 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
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Simple Techniques Minimize Cross-Coupling in Distributed Power Systems
PDF, 335 Kb, 档案已发布: Mar 21, 2007
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AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
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AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
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AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
This application note discusses stresses in wide input DC-DC converters.
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AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

系列: LM2673 (26)

LM2673S-12 LM2673S-12/NOPB LM2673S-3.3 LM2673S-3.3/NOPB LM2673S-5.0 LM2673S-5.0/NOPB LM2673S-ADJ LM2673S-ADJ/NOPB LM2673SD-12/NOPB LM2673SD-3.3/NOPB LM2673SD-5.0/NOPB LM2673SD-ADJ/NOPB LM2673SDX-3.3/NOPB LM2673SDX-5.0/NOPB LM2673SDX-ADJ/NOPB LM2673SX-12/NOPB LM2673SX-3.3/NOPB LM2673SX-5.0 LM2673SX-5.0/NOPB LM2673SX-ADJ LM2673SX-ADJ/NOPB LM2673T-12/NOPB LM2673T-3.3/NOPB LM2673T-5.0/NOPB LM2673T-ADJ LM2673T-ADJ/NOPB

制造商分类

Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)

其他名称:

LM2673S3.3/NOPB, LM2673S 3.3/NOPB