Datasheet Texas Instruments SN74CB3Q16211GQLR — 数据表

24位FET 2.5-V / 3.3-V低压高带宽总线开关56-BGA MICROSTAR JUNIOR -40至85

数据表

PDF, 1.2 Mb, 档案已发布: May 10, 2004

从文件中提取

Lifecycle Status	Obsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample Availability	No

Replacement	SN74CB3Q16211ZQLR
Replacement Code	P

Additional Features	IOFF
Approx. Price (US$)	0.94 \| 1ku
Bandwidth(MHz)	500
Configuration	SPST
ESD Charged Device Model(kV)	1
ESD HBM(kV)	2
ICC(Max)(uA)	3000
Input/Ouput Voltage(Max)(V)	5.5
Input/Output Continuous Current(Max)(mA)	64
Number of Channels(#)	24
Operating Temperature Range(C)	-40 to 85
Package Group	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L (PKG)	56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
Rating	Catalog
Ron(Max)(Ohms)	9
Ron(Typ)(Ohms)	5
VCC(Max)(V)	3.6
VCC(Min)(V)	2.3

RoHS	Not Compliant
Pb Free	No

下载
CBT-C, CB3T, and CB3Q Signal-Switch Families
PDF, 584 Kb, 档案已发布: Feb 4, 2003
Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot
下载
Bus FET Switch Solutions for Live Insertion Applications
PDF, 300 Kb, 档案已发布: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

系列: SN74CB3Q16211 (6)