Datasheet Texas Instruments LM22674MRX-ADJ/NOPB — 数据表

制造商Texas Instruments
系列LM22674
零件号LM22674MRX-ADJ/NOPB
Datasheet Texas Instruments LM22674MRX-ADJ/NOPB

具有精确使能8-SO PowerPAD的SIMPLESWITCHER®4.5V至42V,0.5A降压DC / DC开关稳压器-40至125

数据表

LM22674/-Q1 42 V, 500 mA SIMPLE SWITCHERВ® Step-Down Voltage Regulator with Features datasheet
PDF, 1.3 Mb, 修订版: M, 档案已发布: Nov 4, 2014
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin88
Package TypeDDADDA
Industry STD TermHSOICHSOIC
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY25002500
CarrierLARGE T&RLARGE T&R
Device MarkingADJL22674
Width (mm)3.93.9
Length (mm)4.894.89
Thickness (mm)1.481.48
Pitch (mm)1.271.27
Max Height (mm)1.71.7
Mechanical Data下载下载

参数化

Control ModeVoltage Mode
Duty Cycle(Max)90 %
Iout(Max)0.5 A
Iq(Typ)3.4 mA
Operating Temperature Range-40 to 125 C
Package GroupSO PowerPAD
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Switching Frequency(Max)500 kHz
Switching Frequency(Min)500 kHz
TypeConverter
Vin(Max)42 V
Vin(Min)4.5 V
Vout(Max)37 V
Vout(Min)1.285 V

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: LM22671EVAL
    LM22671 0.5A SIMPLE SWITCHER Regulator w/ Freq Adj or Synch and Precision Enable EVM
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • AN-1533 Overvoltage Protection Circuit for Automotive Load Dump (Rev. B)
    PDF, 83 Kb, 修订版: B, 档案已发布: May 6, 2013
    This application report discusses an over voltage protection circuit for automotive load dump.
  • Input and Output Capacitor Selection
    PDF, 219 Kb, 档案已发布: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
  • AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)
    PDF, 568 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application report provides an in-depth discussion of thermal design.
  • AN-1997 Error Amplifier Limitations in High-Performance Regulator Applications (Rev. A)
    PDF, 153 Kb, 修订版: A, 档案已发布: May 6, 2013
    The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results.
  • SIMPLE SWITCHER Regulators Take Over Automotive Applications (Rev. A)
    PDF, 72 Kb, 修订版: A, 档案已发布: Apr 23, 2013
    Power management applications, typically located on the front line of the automotive electronics system,can be subject to wide input operating voltage extremes resulting from load-dump and cold-crankingconditions. Careful selection of the power management electronics can provide added margin andprotection to the automotive electronics system. The simplest design is provided by a power manage
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Kb, 修订版: A, 档案已发布: Sep 12, 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

制造商分类

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)

其他名称:

LM22674MRXADJ/NOPB, LM22674MRX ADJ/NOPB