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This device is designed specifically to power IMVP Mobile Processors under a strict disclosure
agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For
more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins
Type Drawing TPS51610IRHBR QFN RHB 32 TPS51610IRHBT QFN RHB TPS51610RHBR QFN RHB TPS51610RHBT QFN RHB SPQ Reel
Reel
Diameter Width
(mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
Pin1
(mm) Quadrant 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51610IRHBR QFN RHB 32 3000 346.0 346.0 29.0 TPS51610IRHBT QFN RHB 32 250 190.5 212.7 31.8 TPS51610RHBR QFN RHB 32 3000 346.0 346.0 29.0 TPS51610RHBT QFN RHB 32 250 190.5 212.7 31.8 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins
Type Drawing SPQ Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm) B0
(mm) K0
(mm) P1
(mm) W
Pin1
(mm) Quadrant TPS51611RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 TPS51611RHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION …
