Datasheet Texas Instruments TPS56221DQPR — 数据表

制造商Texas Instruments
系列TPS56221
零件号TPS56221DQPR
Datasheet Texas Instruments TPS56221DQPR

4.5V至14V输入,25A同步降压SWIFT™转换器22-LSON-CLIP -40至125

数据表

TPS56221 4.5-V to 14-V Input, High-Current, Synchronous Buck SWIFTв„ў Converter datasheet
PDF, 1.3 Mb, 修订版: D, 档案已发布: Feb 9, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin22
Package TypeDQP
Industry STD TermLSON-CLIP
JEDEC CodeR-PSSO-N
Package QTY2500
CarrierLARGE T&R
Device MarkingTPS56221
Width (mm)5
Length (mm)6
Thickness (mm)1.5
Pitch (mm).5
Max Height (mm)1.5
Mechanical Data下载

参数化

Control ModeVoltage Mode
Duty Cycle(Max)93 %
Iout(Max)25 A
Iq(Typ)2.5 mA
Operating Temperature Range-40 to 125 C
Package GroupLSON-CLIP
RatingCatalog
Regulated Outputs1
Special FeaturesEnable,Light Load Efficiency,Pre-Bias Start-Up,Synchronous Rectification
Switching Frequency(Max)1000 kHz
Switching Frequency(Min)300 kHz
TypeConverter
Vin(Max)14 V
Vin(Min)4.5 V
Vout(Max)12 V
Vout(Min)0.6 V

生态计划

RoHSCompliant
Pb FreeYes

设计套件和评估模块

  • Evaluation Modules & Boards: TPS56221EVM-579
    Evaluation Module for TPS56221 High Current (25A) Synchronous Step-Down SWIFTВ™ Converter
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • PowerStackв„ў Packaging Technology Overview
    PDF, 515 Kb, 档案已发布: Jul 18, 2011
  • Calculating Efficiency
    PDF, 175 Kb, 档案已发布: Feb 19, 2010
    This application report provides a step-by-step procedure for calculating buck converter efficiency and power dissipation at operating points not provided by the data sheet.
  • Demystifying Type II and Type III Compensators Using Op-Amp and OTA for DC/DC Co
    PDF, 782 Kb, 档案已发布: Jul 11, 2014
  • Understanding Thermal Dissipation and Design of a Heatsink
    PDF, 59 Kb, 档案已发布: May 4, 2011
    Power dissipation performance must be well understood prior to integrating devices on a printed-circuit board (PCB) to ensure that any given device is operated within its defined temperature limits. When a device is running, it consumes electrical energy that is transformed into heat. Most of the heat is typically generated by switching devices like MOSFETs, ICs, etc. This application report discu
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016

模型线

系列: TPS56221 (2)

制造商分类

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)