Datasheet Texas Instruments TMS320C6657CZH — 数据表

制造商	Texas Instruments
系列	TMS320C6657
零件号	TMS320C6657CZH

数据表

价格

状态

打包

参数化

生态计划

设计套件和评估模块

• Evaluation Modules & Boards: TMDSEVM6657
  TMS320C6657 Lite Evaluation Modules
  Lifecycle Status: Active (Recommended for new designs)
  
• JTAG Emulators/ Analyzers: TMDSEMU200-U
  XDS200 USB Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
  XDS560v2 System Trace USB & Ethernet Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
  XDS560v2 System Trace USB Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  

应用须知

• 下载
  PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
  PDF, 57 Kb, 修订版: A, 档案已发布: May 19, 2017
• 下载
  Keystone NDK FAQ
  PDF, 54 Kb, 档案已发布: Oct 3, 2016
  This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
• 下载
  TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
  PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
• 下载
  TI Keystone DSP PCIe SerDes IBIS-AMI Models
  PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
• 下载
  SerDes Implementation Guidelines for KeyStone I Devices
  PDF, 590 Kb, 档案已发布: Oct 31, 2012
  The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
• 下载
  Hardware Design Guide for KeyStone Devices (Rev. C)
  PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
• 下载
  KeyStone I DDR3 Initialization (Rev. E)
  PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
  The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
• 下载
  TMS320C66x DSP Generation of Devices (Rev. A)
  PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
• 下载
  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
• 下载
  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Kb, 档案已发布: Apr 13, 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
• 下载
  PCIe Use Cases for KeyStone Devices
  PDF, 320 Kb, 档案已发布: Dec 13, 2011
• 下载
  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
• 下载
  Optimizing Loops on the C66x DSP
  PDF, 585 Kb, 档案已发布: Nov 9, 2010
• 下载
  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
• 下载
  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
• 下载
  Multicore Programming Guide (Rev. B)
  PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
  As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
• 下载
  Processor SDK RTOS Audio Benchmark Starter Kit
  PDF, 530 Kb, 档案已发布: Apr 12, 2017
  The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
• 下载
  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• 下载
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015

模型线

制造商分类

• Semiconductors > Processors > Digital Signal Processors > C6000 DSP > C66x DSP