Datasheet Texas Instruments TMS320DM335DZCE135 — 数据表

制造商Texas Instruments
系列TMS320DM335
零件号TMS320DM335DZCE135
Datasheet Texas Instruments TMS320DM335DZCE135

数字媒体片上系统(DMSoC)337-NFBGA 0至85

数据表

TMS320DM335 Digital Media System-on-Chip (DMSoC) datasheet
PDF, 1.2 Mb, 修订版: C, 档案已发布: Jun 24, 2010
从文件中提取

价格

状态

Lifecycle StatusNRND (Not recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin337337337
Package TypeZCEZCEZCE
Industry STD TermNFBGANFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-N
Device Marking135DM335DZCETMS320
Width (mm)131313
Length (mm)131313
Thickness (mm).89.89.89
Pitch (mm).65.65.65
Max Height (mm)1.31.31.3
Mechanical Data下载下载下载

生态计划

RoHSNot Compliant
Pb FreeNo

设计套件和评估模块

  • Development Kits: TMDSEVM355
    TMS320DM355 Digital Video Evaluation Module
    Lifecycle Status: NRND (Not recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC (Rev. D)
    PDF, 127 Kb, 修订版: D, 档案已发布: Nov 11, 2009
    This application report contains implementation instructions for the DDR2/mDDR interface contained on the TMS320DM335 Digital Media System-on-Chip (DMSoC) device. The approach to specifying interface timing for the DDR2/mDDR interface is quite different than on previous devices.The previous approach specified device timing in terms of data sheet specifications and simulation models. The syste
  • TMS320DM355/335 Migration Guide (Silicon revision 1.1, 1.3 and 1.4) (Rev. B)
    PDF, 75 Kb, 修订版: B, 档案已发布: Jan 5, 2011
    This application report describes the differences between Silicon revision 1.1, 1.3 and 1.4 of the TMS320DM355/DM335 digital media system-on-chip (DMSoC). This document discusses behavior different from that described in the TMS320DM355 Digital Media System-on-Chip (DMSoC) ARM Subsystem User's Guide (SPRUFB3) and the TMS320DM335 Digital Med
  • Powering the TMS320DM335 and TMS320DM355 with the TPS650061
    PDF, 144 Kb, 档案已发布: Oct 13, 2011
    TPS650061, TMS320DM335, TMS320DM355 Powering the DM335 and DM355 with the TPS650061
  • TMS320DM355 DSP Power Reference Design PR742 (Rev. A)
    PDF, 199 Kb, 修订版: A, 档案已发布: Aug 8, 2008
    This reference design is for the TMS320DM335/DM355 digital signal processor (DSP) and accounts for voltage, current, and sequencing requirements. The operating input voltage ranges from 2 V to 5.5 V for Li-ion batteries and 3 AA batteries. This design also can work with 2 AA batteries with some limitations. The design is optimized for efficiency over the full range of operation and low overall cos
  • Building a Small Embedded Linux Kernel Example (Rev. A)
    PDF, 1.3 Mb, 修订版: A, 档案已发布: May 27, 2008
    Building a Small Embedded Linux Kernel Example Application Report
  • EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)
    PDF, 292 Kb, 修订版: A, 档案已发布: Aug 21, 2008
    This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3.
  • Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)
    PDF, 93 Kb, 修订版: A, 档案已发布: Jul 17, 2008
    This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > Media Processors > DaVinci Video Processors