Data sheet acquired from Harris Semiconductor
SCHS087D -Revised October 2003 The CD4555B and CD4556B types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastics packages (E suffix), and
16-lead small-outline packages (M, M96, and
MT suffixes). The CD4555B is also supplied
in 16-lead small-outline packages (NSR
suffix) and 16-lead thin shrink small-outline
packages (PW and PWR suffixes.) Copyright В© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) 7704701EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704701EA
CD4555BF3A 7704801EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704801EA
CD4556BF3A CD4555BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4555BE CD4555BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4555BE CD4555BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704701EA
CD4555BF3A CD4555BM ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4555BM CD4555BM96 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4555BM CD4555BMT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4555BM CD4555BNSR ACTIVE SO NS 16 2000 Green (RoHS …
