Datasheet Texas Instruments TMS320C6670XCYPA — 数据表

制造商Texas Instruments
系列TMS320C6670
零件号TMS320C6670XCYPA
Datasheet Texas Instruments TMS320C6670XCYPA

多核定点和浮点片上系统841-FCBGA -40至100

数据表

TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip datasheet
PDF, 2.4 Mb, 修订版: D, 档案已发布: Mar 7, 2012
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin841841841
Package TypeCYPCYPCYP
Device MarkingTMS320C6670XCYPA1GHZ@2010 TI
Width (mm)242424
Length (mm)242424
Thickness (mm)2.822.822.82
Mechanical Data下载下载下载

参数化

ApplicationsCommunications and Telecom
DRAMDDR3
DSP4 C66x
DSP MHz1000,1200 Max.
EMAC10/100/1000
GFLOPS64,76.8
Hardware AcceleratorsVCP2,TCP3d,TCP3e,FFT Coprocessor
On-Chip L2 Cache4096 KB
Operating Temperature Range-40 to 100,0 to 85 C
Other On-Chip Memory2048 KB
PCI/PCIe2 PCIe Gen2
Package Size: mm2:W x LSee datasheet (FCBGA) PKG
RatingCatalog
Serial I/OAIF2,I2C,RapidIO,SPI,UART
Serial RapidIO1 (four lanes)
Total On-Chip Memory6528 KB

生态计划

RoHSCompliant

设计套件和评估模块

  • Development Kits: HL5CABLE
    Hyperlink Cable
    Lifecycle Status: Active (Recommended for new designs)
  • Daughter Cards: TMDXEVMPCI
    AMC to PCIe Adapter Card
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: TMDSEVM6678
    TMS320C6678 Evaluation Modules
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: TMDSEVM6670
    TMS320C6670 Evaluation Modules
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • AIF1-to-AIF2 Antenna Interface Migration Guide for KeyStone Devices
    PDF, 640 Kb, 档案已发布: Nov 9, 2010
  • Connecting AIF to FFTC Guide for KeyStone Devices
    PDF, 441 Kb, 档案已发布: Nov 9, 2010
  • Tuning VCP2 and TCP2 Bit Error Rate Performance
    PDF, 293 Kb, 档案已发布: Feb 11, 2011
    In most customer applications, a high level of decoding bit error rate (BER) performance is required. Since Convolutional codes and Turbo codes are widely used in wireless communication systems, TI DSPs integrate two high-performance embedded coprocessors (enhanced Viterbi decoder coprocessor and enhanced Turbo decoder coprocessor) that significantly speed up channel-decoding operations on-chip.
  • Keystone NDK FAQ
    PDF, 54 Kb, 档案已发布: Oct 3, 2016
    This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices.
  • TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
    PDF, 3.2 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
  • TI Keystone DSP PCIe SerDes IBIS-AMI Models
    PDF, 4.8 Mb, 档案已发布: Oct 9, 2014
    This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
  • SerDes Implementation Guidelines for KeyStone I Devices
    PDF, 590 Kb, 档案已发布: Oct 31, 2012
    The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
  • Hardware Design Guide for KeyStone Devices (Rev. C)
    PDF, 1.7 Mb, 修订版: C, 档案已发布: Sep 15, 2013
  • TMS320C66x DSP Generation of Devices (Rev. A)
    PDF, 245 Kb, 修订版: A, 档案已发布: Apr 25, 2011
  • KeyStone I DDR3 Initialization (Rev. E)
    PDF, 114 Kb, 修订版: E, 档案已发布: Oct 28, 2016
    The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, 档案已发布: Dec 13, 2011
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, 档案已发布: Nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore

模型线

制造商分类

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP > C66x DSP