Datasheet CD4013B (Texas Instruments) - 5
| 制造商 | Texas Instruments |
| 描述 | CMOS Dual D-Type Flip-Flop |
| 页数 / 页 | 28 / 5 — CD4013B. www.ti.com. 6.4 Thermal Information. THERMAL METRIC(1). N … |
| 修订版 | E |
| 文件格式/大小 | PDF / 1.6 Mb |
| 文件语言 | 英语 |
CD4013B. www.ti.com. 6.4 Thermal Information. THERMAL METRIC(1). N (PDIP). D (SOIC). NS (SO). PW (TSSOP). UNIT. 14 PINS
文件文字版本
CD4013B www.ti.com
SCHS023E – NOVEMBER 1998 – REVISED SEPTEMBER 2016
6.4 Thermal Information CD4013B THERMAL METRIC(1) N (PDIP) D (SOIC) NS (SO) PW (TSSOP) UNIT 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 47.1 92.5 89.3 121 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.5 54 47.1 49.6 °C/W RθJB Junction-to-board thermal resistance 27.1 46.8 48 62.7 °C/W ψJT Junction-to-top characterization parameter 19.4 19 17 5.9 °C/W ψJB Junction-to-board characterization parameter 27 46.5 47.7 62.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Electrical Characteristics: Static
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = –55°C 1 TA = –40°C 1 VIN = 0 or 5, VDD = 5 TA = 25°C 0.02 1 TA = 85°C 30 TA = 125°C 30 TA = –55°C 2 TA = –40°C 2 VIN = 0 or 10, VDD = 10 TA = 25°C 0.02 2 TA = 85°C 60 TA = 125°C 60 IDDmax Quiescent device current µA TA = –55°C 4 TA = –40°C 4 VIN = 0 or 15, VDD = 15 TA = 25°C 0.02 4 TA = 85°C 120 TA = 125°C 120 TA = –55°C 20 TA = –40°C 20 VIN = 0 or 20, VDD = 20 TA = 25°C 0.04 20 TA = 85°C 600 TA = 125°C 600 Copyright © 1998–2016, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: CD4013B Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics: Static 6.6 Electrical Characteristics: Dynamic 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.3 Application Curve 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Community Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information
SCHS023E – NOVEMBER 1998 – REVISED SEPTEMBER 2016
6.4 Thermal Information CD4013B THERMAL METRIC(1) N (PDIP) D (SOIC) NS (SO) PW (TSSOP) UNIT 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 47.1 92.5 89.3 121 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.5 54 47.1 49.6 °C/W RθJB Junction-to-board thermal resistance 27.1 46.8 48 62.7 °C/W ψJT Junction-to-top characterization parameter 19.4 19 17 5.9 °C/W ψJB Junction-to-board characterization parameter 27 46.5 47.7 62.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Electrical Characteristics: Static
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = –55°C 1 TA = –40°C 1 VIN = 0 or 5, VDD = 5 TA = 25°C 0.02 1 TA = 85°C 30 TA = 125°C 30 TA = –55°C 2 TA = –40°C 2 VIN = 0 or 10, VDD = 10 TA = 25°C 0.02 2 TA = 85°C 60 TA = 125°C 60 IDDmax Quiescent device current µA TA = –55°C 4 TA = –40°C 4 VIN = 0 or 15, VDD = 15 TA = 25°C 0.02 4 TA = 85°C 120 TA = 125°C 120 TA = –55°C 20 TA = –40°C 20 VIN = 0 or 20, VDD = 20 TA = 25°C 0.04 20 TA = 85°C 600 TA = 125°C 600 Copyright © 1998–2016, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: CD4013B Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics: Static 6.6 Electrical Characteristics: Dynamic 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.3 Application Curve 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Community Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information