Datasheet BAV99 (NXP) - 10
| 制造商 | NXP |
| 描述 | High-speed switching diodes |
| 页数 / 页 | 14 / 10 — NXP Semiconductors. BAV99 series. High-speed switching diodes. Fig 14. … |
| 文件格式/大小 | PDF / 341 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BAV99 series. High-speed switching diodes. Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
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文件文字版本
NXP Semiconductors BAV99 series High-speed switching diodes
2.65 1.85 1.325 solder lands
2
solder resist 0.6
3
solder paste 2.35 1.3 (3×) occupied area 0.5
1
(3×) Dimensions in mm 0.55 (3×) sot323_fr
Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
4.6 2.575 1.425 (3×) solder lands solder resist occupied area 3.65 2.1 1.8 Dimensions in mm preferred transport 09 direction during soldering (2×) sot323_fw
Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
2.65 1.85 1.325 solder lands
2
solder resist 0.6
3
solder paste 2.35 1.3 (3×) occupied area 0.5
1
(3×) Dimensions in mm 0.55 (3×) sot323_fr
Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
4.6 2.575 1.425 (3×) solder lands solder resist occupied area 3.65 2.1 1.8 Dimensions in mm preferred transport 09 direction during soldering (2×) sot323_fw
Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70)
BAV99_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 8 — 18 November 2010 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents