Datasheet TB9M040FTG (Toshiba)
| 制造商 | Toshiba |
| 描述 | IC for automotive three-phase brushless DC motor in 36-VFQFPN package |
| 页数 / 页 | 38 / 1 — Preliminary. TB9M040FTG. 1. Description. 2. Applications. 3. Features |
| 文件格式/大小 | PDF / 1.0 Mb |
| 文件语言 | 英语 |
Preliminary. TB9M040FTG. 1. Description. 2. Applications. 3. Features
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Preliminary
TB9M040FTG Bi-CMOS Linear Integrated Circuit Silicon Monolithic
TB9M040FTG
IC for automotive three-phase brushless DC motor
1. Description
The TB9M040FTG is an integrated IC combining an automotive microcontroller unit (MCU) and a motor driver. It incorporates Toshiba’s unique Vector Engine (VE) to simplify motor vector control and reduce CPU load. The product is developed in accordance with ISO 26262 functional safety standards. P-VQFN36-0606-0.50-004 weight: 0.102g (typ.)
2. Applications
For automotive equipment (electric valves, HVAC dampers, flaps, and gril e shutters), three-phase small brushless DC motor control and drive.
3. Features
• System size reduction is achievable through integration of an MCU, a three‑phase brushless DC motor driver, a high‑side driver, a LIN transceiver, and an automotive power supply system. • Built‑in power MOSFETs enable direct drive of three‑phase brushless DC motors. • The high‑side driver output can supply a 5 V power source. • It features Toshiba’s proprietary Vector Engine (VE), which reduces CPU load in FOC motor control applications. • Built‑in BEMF detection enables sensorless motor control. Do not design your products or systems based on the information on this document. Please contact your Toshiba sales representative for updated information before designing your products. **************************************************************************************************************** * Arm and Cortex are registered trademarks of Arm Limited (or its subsidiary) in the US and/or elsewhere. **************************************************************************************************************** © 2 026 1 2026-3-26 Toshiba Electronic Devices & Storage Corporation Rev. 1.0 Document Outline 1. Description 2. Applications 3. Features 4. Functions 5. Block Diagram 6. Pin Assignments 7. Pin Description 8. I/O Equivalent Circuits 9. Functional Description 9.1. Bridge Drivers (BDRV) Circuit 9.2. High Side Driver (HSD) 9.3. Current-Sense Amplifier (CSAMP) 9.4. Current Limit Comparator (CLCMP) 9.5. Overcurrent Detection Comparator (OCCMP) 9.6. Vector Engine(VE) 9.7. Programmable Motor Driver (PMD) 9.8. Memory Map 10. Electrical Characteristics 10.1. Absolute Maximum Ratings 10.2. Operating Ranges 10.3. Overall Electrical Characteristics 10.4. Reset Generator and Standby Time 10.5. 5-V Regulator (LDO5V) 10.6. 1.5-V Regulator (LDO15V) 10.7. Charge Pump 10.8. Oscillator 10.9. 12-bit ADC 10.10. Bridge Drivers (BRDV) 10.11. Current-Sense Amplifier (CSAMP) 10.12. Current Limit Comparator (CLCMP) 10.13. Overcurrent Detection Comparator (OCCMP) 10.14. Back-EMF Comparator (BEMFCMP) 10.15. Thermal Shutdown (TSD) Circuit 10.16. LIN 10.17. UART 10.18. SPI 10.19. GPIO 10.20. Flash (Code Flash) 10.21. Other 11. Application Circuit Example 12. Package Information 12.1. Package Dimensions 12.2. Marking 13. IC Usage Considerations 13.1. Notes on Handling of ICs 13.2. Points to Remember on Handling of ICs RESTRICTIONS ON PRODUCT USE
TB9M040FTG Bi-CMOS Linear Integrated Circuit Silicon Monolithic
TB9M040FTG
IC for automotive three-phase brushless DC motor
1. Description
The TB9M040FTG is an integrated IC combining an automotive microcontroller unit (MCU) and a motor driver. It incorporates Toshiba’s unique Vector Engine (VE) to simplify motor vector control and reduce CPU load. The product is developed in accordance with ISO 26262 functional safety standards. P-VQFN36-0606-0.50-004 weight: 0.102g (typ.)
2. Applications
For automotive equipment (electric valves, HVAC dampers, flaps, and gril e shutters), three-phase small brushless DC motor control and drive.
3. Features
• System size reduction is achievable through integration of an MCU, a three‑phase brushless DC motor driver, a high‑side driver, a LIN transceiver, and an automotive power supply system. • Built‑in power MOSFETs enable direct drive of three‑phase brushless DC motors. • The high‑side driver output can supply a 5 V power source. • It features Toshiba’s proprietary Vector Engine (VE), which reduces CPU load in FOC motor control applications. • Built‑in BEMF detection enables sensorless motor control. Do not design your products or systems based on the information on this document. Please contact your Toshiba sales representative for updated information before designing your products. **************************************************************************************************************** * Arm and Cortex are registered trademarks of Arm Limited (or its subsidiary) in the US and/or elsewhere. **************************************************************************************************************** © 2 026 1 2026-3-26 Toshiba Electronic Devices & Storage Corporation Rev. 1.0 Document Outline 1. Description 2. Applications 3. Features 4. Functions 5. Block Diagram 6. Pin Assignments 7. Pin Description 8. I/O Equivalent Circuits 9. Functional Description 9.1. Bridge Drivers (BDRV) Circuit 9.2. High Side Driver (HSD) 9.3. Current-Sense Amplifier (CSAMP) 9.4. Current Limit Comparator (CLCMP) 9.5. Overcurrent Detection Comparator (OCCMP) 9.6. Vector Engine(VE) 9.7. Programmable Motor Driver (PMD) 9.8. Memory Map 10. Electrical Characteristics 10.1. Absolute Maximum Ratings 10.2. Operating Ranges 10.3. Overall Electrical Characteristics 10.4. Reset Generator and Standby Time 10.5. 5-V Regulator (LDO5V) 10.6. 1.5-V Regulator (LDO15V) 10.7. Charge Pump 10.8. Oscillator 10.9. 12-bit ADC 10.10. Bridge Drivers (BRDV) 10.11. Current-Sense Amplifier (CSAMP) 10.12. Current Limit Comparator (CLCMP) 10.13. Overcurrent Detection Comparator (OCCMP) 10.14. Back-EMF Comparator (BEMFCMP) 10.15. Thermal Shutdown (TSD) Circuit 10.16. LIN 10.17. UART 10.18. SPI 10.19. GPIO 10.20. Flash (Code Flash) 10.21. Other 11. Application Circuit Example 12. Package Information 12.1. Package Dimensions 12.2. Marking 13. IC Usage Considerations 13.1. Notes on Handling of ICs 13.2. Points to Remember on Handling of ICs RESTRICTIONS ON PRODUCT USE