Datasheet EPC2218 (Efficient Power Conversion) - 6

eGaN® FET DATASHEET
EPC2218
RECOMMENDED
A Land pattern is solder mask defined. m
LAND PATTERN DIM Nominal
(units in µm)
A
3500
1 B
1950 e1
c1
1605
d1
1780
e1
755 h
3 4
d1
5 6 7
c1
8
B
f
230
g
500
h
1025
2
e1
k
462.5
m
250 k Pad 1 is Gate; f g Pads 2 ,4, 6, 8 are Source; Pads 3, 5, 7 are Drain
RECOMMENDED STENCIL DRAWING
(units in µm) A m
DIM Nominal
f2 f2
A
3500
B
1950
c1
1605 e1
d1
1780
e1
755
f1
230 h f1 d1 c1 B
f2
210
g
500
h
1025
k
e1 462.5 R60
m
250 k f1 g Recommended stencil should be 4 mil (100 µm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 4 solder, reference 88.5% metals content. The corner has a radius of R60. Split stencil design can be provided upon request, but EPC has tested this stencil design and not found any scooping issues. Additional assembly resources available at https://epc-co.com/epc/design-support EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2026 | For more information:
info@epc-co.com
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