Datasheet LTC7891 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 100 V, Low IQ, Synchronous Step-Down Controller for GaN FETs in 28-Lead QFN (4mm x 5mm, Plastic Side Wettable) package |
| 页数 / 页 | 36 / 6 — LTC7891. ABSOLUTE MAXIMUM RATINGS. Table 2. Absolute Maximum Ratings. … |
| 文件格式/大小 | PDF / 1.7 Mb |
| 文件语言 | 英语 |
LTC7891. ABSOLUTE MAXIMUM RATINGS. Table 2. Absolute Maximum Ratings. Parameter. Rating. ESD CAUTION
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LTC7891 ABSOLUTE MAXIMUM RATINGS Table 2. Absolute Maximum Ratings
Stresses at or above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the product. This is a stress Input Supply (V rating only; functional operation of the product at these or any other IN) –0.3 V to +100 V RUN –0.3 V to +100 V conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- BOOST –0.3 V to +106 V ing conditions for extended periods may affect product reliability. SW –5 V to +100 V BOOST to SW –0.3 V to +6 V
ESD CAUTION
BGUP, BGDN, TGUP, TGDN1 Not applicable
ESD (electrostatic discharge) sensitive device
. Charged devi- EXTVCC –0.3 V to +30 V ces and circuit boards can discharge without detection. Although DRVCC, INTVCC, BSTVCC –0.3 V to +6 V this product features patented or proprietary protection circuitry, VFB –0.3 V to +15 V damage may occur on devices subjected to high energy ESD. PLLIN/SPREAD, FREQ –0.3 V to +6 V Therefore, proper ESD precautions should be taken to avoid TRACK/SS, ITH –0.3 V to +6 V performance degradation or loss of functionality. DRVSET, DRVUV –0.3 V to +6 V MODE, ILIM, VPRG –0.3 V to +6 V PGOOD –0.3 V to +6 V DTCA, DTCB –0.3 V to +6 V SENSE+, SENSE– –0.3 V to +65 V SENSE+ to SENSE– Continuous –0.3 V to +0.3 V <1 ms –100 mA to +100 mA Operating Junction Temperature Range2 –40°C to +150°C Storage Temperature Range –65°C to +150°C 1 Do not apply a voltage or current source to these pins. They must be connect- ed to capacitive loads only. Otherwise, permanent damage may occur. 2 The LTC7891R is specified over the –40°C to 150°C operating junction temperature range. High junction temperatures degrade operating lifetimes. Note the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with the board layout, rated package thermal impedance, and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the following formula: TJ = TA + (PD × θJA), where θJA (in °C/W) is the package thermal impedance.
analog.com Rev. A | 6 of 36
Document Outline Features Applications Typical Application Circuit General Description Specifications Electrical Characteristics Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Functional Diagram Main Control Loop Power and Bias Supplies (VIN, EXTVCC, DRVCC, and INTVCC) High-Side Bootstrap Capacitor Dead Time Control (DTCA and DTCB Pins) Startup and Shutdown (RUN and TRACK/SS Pins) Light Load Operation: Burst Mode Operation, Pulse Skipping Mode, or Forced Continuous Mode (MODE Pin) Frequency Selection, Spread Spectrum, and Phase-Locked Loop (FREQ and PLLIN/SPREAD Pins) Output Overvoltage Protection Foldback Current Power Good Applications Information Inductor Value Calculation Inductor Core Selection Current Sense Selection Low Value Resistor Current Sensing Inductor DCR Current Sensing Setting the Operating Frequency Selecting the Light Load Operating Mode Dead Time Control (DTCA and DTCB Pins) DTCx Pins Tied to GND (Adaptive Dead Time Control) DTCx Pins Tied to INTVCC (Smart Near Zero Dead Time Control) DTCx Pins Connected with a Resistor to GND Power FET Selection CIN and COUT Selection Setting the Output Voltage RUN Pin and Undervoltage Lockout Soft Start and Tracking (TRACK/SS Pin) INTVCC Regulators (OPTI-DRIVE) Topside FET Driver Supply (CB) Minimum On Time Considerations Fault Conditions: Current Limit and Foldback Fault Conditions: Overvoltage Protection Fault Conditions: Overtemperature Protection Phase-Locked Loop and Frequency Synchronization Efficiency Considerations Checking Transient Response Design Example PCB Layout Checklist PCB Layout Debugging Typical Applications Related Products Outline Dimensions Ordering Guide Evaluation Boards Automotive Products
LTC7891 ABSOLUTE MAXIMUM RATINGS Table 2. Absolute Maximum Ratings
Stresses at or above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the product. This is a stress Input Supply (V rating only; functional operation of the product at these or any other IN) –0.3 V to +100 V RUN –0.3 V to +100 V conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- BOOST –0.3 V to +106 V ing conditions for extended periods may affect product reliability. SW –5 V to +100 V BOOST to SW –0.3 V to +6 V
ESD CAUTION
BGUP, BGDN, TGUP, TGDN1 Not applicable
ESD (electrostatic discharge) sensitive device
. Charged devi- EXTVCC –0.3 V to +30 V ces and circuit boards can discharge without detection. Although DRVCC, INTVCC, BSTVCC –0.3 V to +6 V this product features patented or proprietary protection circuitry, VFB –0.3 V to +15 V damage may occur on devices subjected to high energy ESD. PLLIN/SPREAD, FREQ –0.3 V to +6 V Therefore, proper ESD precautions should be taken to avoid TRACK/SS, ITH –0.3 V to +6 V performance degradation or loss of functionality. DRVSET, DRVUV –0.3 V to +6 V MODE, ILIM, VPRG –0.3 V to +6 V PGOOD –0.3 V to +6 V DTCA, DTCB –0.3 V to +6 V SENSE+, SENSE– –0.3 V to +65 V SENSE+ to SENSE– Continuous –0.3 V to +0.3 V <1 ms –100 mA to +100 mA Operating Junction Temperature Range2 –40°C to +150°C Storage Temperature Range –65°C to +150°C 1 Do not apply a voltage or current source to these pins. They must be connect- ed to capacitive loads only. Otherwise, permanent damage may occur. 2 The LTC7891R is specified over the –40°C to 150°C operating junction temperature range. High junction temperatures degrade operating lifetimes. Note the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with the board layout, rated package thermal impedance, and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the following formula: TJ = TA + (PD × θJA), where θJA (in °C/W) is the package thermal impedance.
analog.com Rev. A | 6 of 36
Document Outline Features Applications Typical Application Circuit General Description Specifications Electrical Characteristics Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Functional Diagram Main Control Loop Power and Bias Supplies (VIN, EXTVCC, DRVCC, and INTVCC) High-Side Bootstrap Capacitor Dead Time Control (DTCA and DTCB Pins) Startup and Shutdown (RUN and TRACK/SS Pins) Light Load Operation: Burst Mode Operation, Pulse Skipping Mode, or Forced Continuous Mode (MODE Pin) Frequency Selection, Spread Spectrum, and Phase-Locked Loop (FREQ and PLLIN/SPREAD Pins) Output Overvoltage Protection Foldback Current Power Good Applications Information Inductor Value Calculation Inductor Core Selection Current Sense Selection Low Value Resistor Current Sensing Inductor DCR Current Sensing Setting the Operating Frequency Selecting the Light Load Operating Mode Dead Time Control (DTCA and DTCB Pins) DTCx Pins Tied to GND (Adaptive Dead Time Control) DTCx Pins Tied to INTVCC (Smart Near Zero Dead Time Control) DTCx Pins Connected with a Resistor to GND Power FET Selection CIN and COUT Selection Setting the Output Voltage RUN Pin and Undervoltage Lockout Soft Start and Tracking (TRACK/SS Pin) INTVCC Regulators (OPTI-DRIVE) Topside FET Driver Supply (CB) Minimum On Time Considerations Fault Conditions: Current Limit and Foldback Fault Conditions: Overvoltage Protection Fault Conditions: Overtemperature Protection Phase-Locked Loop and Frequency Synchronization Efficiency Considerations Checking Transient Response Design Example PCB Layout Checklist PCB Layout Debugging Typical Applications Related Products Outline Dimensions Ordering Guide Evaluation Boards Automotive Products