Datasheet AL3069Q (Diodes) - 4
| 制造商 | Diodes |
| 描述 | Automotive Display LED-Backlight Driver |
| 页数 / 页 | 18 / 4 — AL3069Q. Absolute Maximum Ratings. Symbol. Parameter. Rating. Unit. … |
| 文件格式/大小 | PDF / 1.4 Mb |
| 文件语言 | 英语 |
AL3069Q. Absolute Maximum Ratings. Symbol. Parameter. Rating. Unit. Package Thermal Information. TSSOP-16EP. U-QFN4040-16/SWP. (Type DX)
该数据表的模型线
文件文字版本
AL3069Q Absolute Maximum Ratings
(@TA = +25°C, unless otherwise specified.) (Notes 4, 5)
Symbol Parameter Rating Unit
VCH CH1 to CH4 Pins Voltage -0.3 to 80 V VIN, VCS, VOVP Voltage on VIN, CS and OVP pin -0.3 to 60 V VEN EN Pin Voltage -0.3 to 7 V VCC VCC Output Pin Voltage -0.3 to 7 V VCOMP, VISET, VOUT COMP Pin Voltage, ISET Pin Voltage, OUT Pin Voltage -0.3 to 7 V VRT RT Pin Voltage -0.3 to 7 V VFAULTB FAULTB Pin Voltage -0.3 to 7 V VPWMD PWMD Pin Voltage -0.3 to 7 V VGND GND Pin Voltage -0.3 to 0.3 V TJ Operating Junction Temperature +150 °C TSTG Storage Temperature -65 to +150 °C TLEAD Lead Temperature (Soldering, 10sec) +260 °C — ESD (Charged Device Model, CDM) 1000 V — ESD (Human Body Model, HBM) 2000 V Notes: 4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. 5. For better performance, the AL3069Q should have high-voltage pins CS and OVP. If CS or OVP pin is added to 16V, the IC will not smoke or burn.
Package Thermal Information
(Note 6)
TSSOP-16EP U-QFN4040-16/SWP Symbol Parameter Unit (Type DX) (Type UXB)
RθJA Junction-to-Ambient Thermal Resistance 31.5 30.8 °C/W RθJC(top) Junction-to-Case (Top) Thermal Resistance 42.0 27.3 °C/W RθJB Junction-to-Board Thermal Resistance 12.2 10.8 °C/W ψJT Junction-to-Top Characterization Parameter 1.2 0.16 °C/W ψJB Junction-to-Board Characterization Parameter 12.4 10.7 °C/W RθJC(bot) Junction-to-Case (Bottom) Thermal Resistance 1.5 1.0 °C/W Note: 6. The device is mounted on JEDEC standard 4 layers (2s2p) PCB test board with minimum recommended pad layout.
Recommended Operating Conditions Symbol Parameter Min Max Unit
VIN Input Voltage 4.5 60 V fSW Operating Switching Frequency 0.1 1 MHz ICH LED Channel Current 20 400 mA fPWMD Direct PWM Dimming Frequency 0.1 2 kHz TA Operating Ambient Temperature -40 +125 °C AL3069Q 4 of 18 July 2025 Document number: DS46159 Rev. 2 - 2
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(@TA = +25°C, unless otherwise specified.) (Notes 4, 5)
Symbol Parameter Rating Unit
VCH CH1 to CH4 Pins Voltage -0.3 to 80 V VIN, VCS, VOVP Voltage on VIN, CS and OVP pin -0.3 to 60 V VEN EN Pin Voltage -0.3 to 7 V VCC VCC Output Pin Voltage -0.3 to 7 V VCOMP, VISET, VOUT COMP Pin Voltage, ISET Pin Voltage, OUT Pin Voltage -0.3 to 7 V VRT RT Pin Voltage -0.3 to 7 V VFAULTB FAULTB Pin Voltage -0.3 to 7 V VPWMD PWMD Pin Voltage -0.3 to 7 V VGND GND Pin Voltage -0.3 to 0.3 V TJ Operating Junction Temperature +150 °C TSTG Storage Temperature -65 to +150 °C TLEAD Lead Temperature (Soldering, 10sec) +260 °C — ESD (Charged Device Model, CDM) 1000 V — ESD (Human Body Model, HBM) 2000 V Notes: 4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. 5. For better performance, the AL3069Q should have high-voltage pins CS and OVP. If CS or OVP pin is added to 16V, the IC will not smoke or burn.
Package Thermal Information
(Note 6)
TSSOP-16EP U-QFN4040-16/SWP Symbol Parameter Unit (Type DX) (Type UXB)
RθJA Junction-to-Ambient Thermal Resistance 31.5 30.8 °C/W RθJC(top) Junction-to-Case (Top) Thermal Resistance 42.0 27.3 °C/W RθJB Junction-to-Board Thermal Resistance 12.2 10.8 °C/W ψJT Junction-to-Top Characterization Parameter 1.2 0.16 °C/W ψJB Junction-to-Board Characterization Parameter 12.4 10.7 °C/W RθJC(bot) Junction-to-Case (Bottom) Thermal Resistance 1.5 1.0 °C/W Note: 6. The device is mounted on JEDEC standard 4 layers (2s2p) PCB test board with minimum recommended pad layout.
Recommended Operating Conditions Symbol Parameter Min Max Unit
VIN Input Voltage 4.5 60 V fSW Operating Switching Frequency 0.1 1 MHz ICH LED Channel Current 20 400 mA fPWMD Direct PWM Dimming Frequency 0.1 2 kHz TA Operating Ambient Temperature -40 +125 °C AL3069Q 4 of 18 July 2025 Document number: DS46159 Rev. 2 - 2
www.diodes.com
© 2025 Copyright Diodes Incorporated. All Rights Reserved.