MDF 11 N65 C C = C + C (C = shorted) iss gs gd ds 10 oss ※ Note : I = 12.0A 2800 C = C + C D oss ds gd C = C rss gd B 130V ] 2400 N 8 325V Ciss - e [V 520V c 2000 tag ha ol 6 e [pF] 1600 nnel e V c ur tanci 4 1200 -So MOS C ※ Notes ; rss ate 1. V = 0 V Capac 800 GS 2 , G 2. f = 1 MHz GS V 400 FET 0 0 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 1 10 5 Q , Total Gate Charge [nC] V , Drain-Source Voltage [V] 0 G DS VFig.7 Gate Charge CharacteristicsFig.8 Capacitance Characteristics 102 Operation in This Areais Limited by R DS(on) D=0.5 10 s 100 101 100 s 0.2 1 ms se 10 ms 0.1 100 ms DC urrent [A] (t), C 100 J Respon 0.05 θZ al m 0.02 , Drain C her 10-1 I D T 0.01 ※ Notes : 10-1 Duty Factor, D=t /t 1 2 PEAK T = P * Z * R (t) + T J DM θ JC θ JC C Single Pulse single pulse R =2.52℃ /W Θ JC T =Max ratedJT =25℃C 10-2 10-5 10-4 10-3 10-2 10-1 100 101 10-1 100 101 102 t , Rectangular Pulse Duration [sec] 1 V , Drain-Source Voltage [V] DS Fig.9 Maximum Safe Operating AreaFig.10 Transient Thermal Response Curve 6000 14 13 single Pulse 12 5000 R= 2.52℃ /WthJCT = 25℃ 11 C 10 ] 4000 [A 9 ) ent 8 r (W 3000 7 re n Cur 6 w ai o P 5 2000 , Dr I D 4 3 1000 2 1 0 0 1E-5 1E-4 1E-3 0.01 0.1 1 10 25 50 75 100 125 150 Pulse Width (s) T , Case Temperature [℃ ] C Fig.11 Single Pulse Maximum PowerFig.12 Maximum Drain Current vs. CaseDissipationTemperature Jan. 2021. Version 1.2 4 Magnachip Semiconductor Ltd.