Datasheet GD32E103xx (GigaDevice) - 6
| 制造商 | GigaDevice |
| 描述 | Arm Cortex-M4 32-bit MCU |
| 页数 / 页 | 91 / 6 — List of Tables. Table 2-1. GD32E103xx devices features and peripheral … |
| 修订版 | 1.15 |
| 文件格式/大小 | PDF / 3.1 Mb |
| 文件语言 | 英语 |
List of Tables. Table 2-1. GD32E103xx devices features and peripheral list .. 8. Table 2-2. GD32E103xx memory map .. 12
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List of Tables Table 2-1. GD32E103xx devices features and peripheral list .. 8 Table 2-2. GD32E103xx memory map .. 12 Table 2-3. GD32E103Vx LQFP100 pin definitions ... 17 Table 2-4. GD32E103Rx LQFP64 pin definitions .. 23 Table 2-5. GD32E103Cx LQFP48 pin definitions .. 27 Table 2-6. GD32E103Tx QFN36 pin definitions ... 30 Table 4-1. Absolute maximum ratings(1)(4) ... 41 Table 4-2. DC operating conditions ... 42 Table 4-3. Clock frequency(1) .. 42 Table 4-4. Operating conditions at Power up/ Power down(1) ... 42 Table 4-5. Start-up timings of Operating conditions(1)(2)(3) ... 43 Table 4-6. Power saving mode wakeup timings characteristics(1)(2) ... 43 Table 4-7. Power consumption characteristics(2)(3)(4)(5)(6) .. 43 Table 4-8. Peripheral current consumption characteristics(1) ... 49 Table 4-9. EMS characteristics(1) .. 50 Table 4-10. EMI characteristics(1) ... 51 Table 4-11. Power supply supervisor characteristics.. 51 Table 4-12. ESD characteristics(1) .. 52 Table 4-13. Static latch-up characteristics(1) ... 53 Table 4-14. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics . 53 Table 4-15. High speed external clock characteristics (HXTAL in bypass mode) .. 53 Table 4-16. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 54 Table 4-17.Low speed external user clock characteristics (LXTAL in bypass mode).. 54 Table 4-18. High speed internal clock (IRC8M) characteristics .. 55 Table 4-19. Low speed internal clock (IRC40K) characteristics ... 55 Table 4-20. High speed internal clock (IRC48M) characteristics .. 56 Table 4-21. PLL characteristics .. 56 Table 4-22. PLL1/2 characteristics ... 56 Table 4-23. Flash memory characteristics .. 57 Table 4-24. NRST pin characteristics .. 57 Table 4-25. I/O port DC characteristics(1)(3) .. 58 Table 4-26. I/O port AC characteristics(1)(2) .. 59 Table 4-27. ADC characteristics ... 60 Table 4-28. ADC RAIN max for fADC = 42 MHz .. 60 Table 4-29. ADC dynamic accuracy at fADC = 14 MHz(1) .. 61 Table 4-30. ADC dynamic accuracy at fADC = 42 MHz(1) .. 61 Table 4-31. ADC static accuracy at fADC = 42 MHz(1) ... 61 Table 4-32. Temperature sensor characteristics(1) ... 61 Table 4-33. DAC characteristics ... 61 Table 4-34. I2C characteristics(1)(2) ... 63
5 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E103Vx LQFP100 pin definitions 2.6.2. GD32E103Rx LQFP64 pin definitions 2.6.3. GD32E103Cx LQFP48 pin definitions 2.6.4. GD32E103Tx QFN36 pin definitions 3. Functional description 3.1. Arm® Cortex®-M4 core 3.2. On-chip memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal serial bus full-speed interface (USBFS) 3.17. External memory controller (EXMC) 3.18. Debug mode 3.19. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. ADC characteristics 4.14. Temperature sensor characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. USBFS characteristics 4.21. EXMC characteristics 4.22. TIMER characteristics 4.23. WDGT characteristics 4.24. Parameter conditions 5. Package information 5.1. LQFP100 package outline dimensions 5.2. LQFP64 package outline dimensions 5.3. LQFP48 package outline dimensions 5.4. QFN36 package outline dimensions 5.5. Thermal characteristics 6. Ordering information 7. Revision history
List of Tables Table 2-1. GD32E103xx devices features and peripheral list .. 8 Table 2-2. GD32E103xx memory map .. 12 Table 2-3. GD32E103Vx LQFP100 pin definitions ... 17 Table 2-4. GD32E103Rx LQFP64 pin definitions .. 23 Table 2-5. GD32E103Cx LQFP48 pin definitions .. 27 Table 2-6. GD32E103Tx QFN36 pin definitions ... 30 Table 4-1. Absolute maximum ratings(1)(4) ... 41 Table 4-2. DC operating conditions ... 42 Table 4-3. Clock frequency(1) .. 42 Table 4-4. Operating conditions at Power up/ Power down(1) ... 42 Table 4-5. Start-up timings of Operating conditions(1)(2)(3) ... 43 Table 4-6. Power saving mode wakeup timings characteristics(1)(2) ... 43 Table 4-7. Power consumption characteristics(2)(3)(4)(5)(6) .. 43 Table 4-8. Peripheral current consumption characteristics(1) ... 49 Table 4-9. EMS characteristics(1) .. 50 Table 4-10. EMI characteristics(1) ... 51 Table 4-11. Power supply supervisor characteristics.. 51 Table 4-12. ESD characteristics(1) .. 52 Table 4-13. Static latch-up characteristics(1) ... 53 Table 4-14. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics . 53 Table 4-15. High speed external clock characteristics (HXTAL in bypass mode) .. 53 Table 4-16. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 54 Table 4-17.Low speed external user clock characteristics (LXTAL in bypass mode).. 54 Table 4-18. High speed internal clock (IRC8M) characteristics .. 55 Table 4-19. Low speed internal clock (IRC40K) characteristics ... 55 Table 4-20. High speed internal clock (IRC48M) characteristics .. 56 Table 4-21. PLL characteristics .. 56 Table 4-22. PLL1/2 characteristics ... 56 Table 4-23. Flash memory characteristics .. 57 Table 4-24. NRST pin characteristics .. 57 Table 4-25. I/O port DC characteristics(1)(3) .. 58 Table 4-26. I/O port AC characteristics(1)(2) .. 59 Table 4-27. ADC characteristics ... 60 Table 4-28. ADC RAIN max for fADC = 42 MHz .. 60 Table 4-29. ADC dynamic accuracy at fADC = 14 MHz(1) .. 61 Table 4-30. ADC dynamic accuracy at fADC = 42 MHz(1) .. 61 Table 4-31. ADC static accuracy at fADC = 42 MHz(1) ... 61 Table 4-32. Temperature sensor characteristics(1) ... 61 Table 4-33. DAC characteristics ... 61 Table 4-34. I2C characteristics(1)(2) ... 63
5 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E103Vx LQFP100 pin definitions 2.6.2. GD32E103Rx LQFP64 pin definitions 2.6.3. GD32E103Cx LQFP48 pin definitions 2.6.4. GD32E103Tx QFN36 pin definitions 3. Functional description 3.1. Arm® Cortex®-M4 core 3.2. On-chip memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal serial bus full-speed interface (USBFS) 3.17. External memory controller (EXMC) 3.18. Debug mode 3.19. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. ADC characteristics 4.14. Temperature sensor characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. USBFS characteristics 4.21. EXMC characteristics 4.22. TIMER characteristics 4.23. WDGT characteristics 4.24. Parameter conditions 5. Package information 5.1. LQFP100 package outline dimensions 5.2. LQFP64 package outline dimensions 5.3. LQFP48 package outline dimensions 5.4. QFN36 package outline dimensions 5.5. Thermal characteristics 6. Ordering information 7. Revision history