Datasheet NTCSC0201E3.....T (Vishay) - 2
| 制造商 | Vishay |
| 描述 | SMD 0201, Commercial Grade NTC Thermistors |
| 页数 / 页 | 3 / 2 — NTCSC0201E3...T. DIMENSIONS. L2 AND L3. SOLDERING CONDITIONS. Reflow … |
| 文件格式/大小 | PDF / 103 Kb |
| 文件语言 | 英语 |
NTCSC0201E3...T. DIMENSIONS. L2 AND L3. SOLDERING CONDITIONS. Reflow Soldering. Lead (Pb)-free Reflow Soldering Profile. e (°C)
该数据表的模型线
文件文字版本
NTCSC0201E3...T
www.vishay.com Vishay BCcomponents
DIMENSIONS
in millimeters
L1 W T L2 AND L3
T W 0.6 ± 0.05 0.3 ± 0.05 0.3 ± 0.05 0.15 ± 0.05 L L 2 3 L1
SOLDERING CONDITIONS
Soldering, handling, and mounting conditions are detailed in the instructions document: see www.vishay.com/doc?29224. Typical examples of soldering processes that will provide reliable joints without damage, are shown below.
Reflow Soldering Lead (Pb)-free Reflow Soldering Profile
300 10 s 40 s max. 300 260 °C 260 °C 250 250 | 245 °C |245 °C 235 °C 200 215 °C 200
e (°C)
10 s 180 °C |170 °C 20 s min. 150 130 °C 150 |120 °C |60 s 40 s 100 6 K/s
mperatur
100
e emperature (°C)
max.
T
2 K/s
T
2 K/s 50 50 max. limit normal 0 0 0 50 100 150 200 250 0 50 100 150 200 250 300 350
Time (s) Time (s) Recommended solder land pattern dimensions (mm)
0.25 0.3 0.75
PACKAGING TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
DIMENSIONS OF PAPER TAPE
in millimeters Sprocket holes
PARAMETER DIMENSION
P Ø D T 0 0 A0 (1) 0.4 ± 0.1 B0 (1) 0.7 ± 0.1 E W 0.8 ± 0.3 E 1.75 ± 0.1 B0 F W F 3.5 ± 0.05 D0 1.55 ± 0.05 P0 (2) 4.0 ± 0.05 P1 2.0 ± 0.05 A P 0 T tape thickness max. 0.55 1 Chip cavity
Notes
(1) Measured 0.3 mm above base pocket (2) P0 pitch cumulative error over any 10 pitches ± 0.2 mm Revision: 24-Mar-2025
2
Document Number: 29243 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay BCcomponents
DIMENSIONS
in millimeters
L1 W T L2 AND L3
T W 0.6 ± 0.05 0.3 ± 0.05 0.3 ± 0.05 0.15 ± 0.05 L L 2 3 L1
SOLDERING CONDITIONS
Soldering, handling, and mounting conditions are detailed in the instructions document: see www.vishay.com/doc?29224. Typical examples of soldering processes that will provide reliable joints without damage, are shown below.
Reflow Soldering Lead (Pb)-free Reflow Soldering Profile
300 10 s 40 s max. 300 260 °C 260 °C 250 250 | 245 °C |245 °C 235 °C 200 215 °C 200
e (°C)
10 s 180 °C |170 °C 20 s min. 150 130 °C 150 |120 °C |60 s 40 s 100 6 K/s
mperatur
100
e emperature (°C)
max.
T
2 K/s
T
2 K/s 50 50 max. limit normal 0 0 0 50 100 150 200 250 0 50 100 150 200 250 300 350
Time (s) Time (s) Recommended solder land pattern dimensions (mm)
0.25 0.3 0.75
PACKAGING TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
DIMENSIONS OF PAPER TAPE
in millimeters Sprocket holes
PARAMETER DIMENSION
P Ø D T 0 0 A0 (1) 0.4 ± 0.1 B0 (1) 0.7 ± 0.1 E W 0.8 ± 0.3 E 1.75 ± 0.1 B0 F W F 3.5 ± 0.05 D0 1.55 ± 0.05 P0 (2) 4.0 ± 0.05 P1 2.0 ± 0.05 A P 0 T tape thickness max. 0.55 1 Chip cavity
Notes
(1) Measured 0.3 mm above base pocket (2) P0 pitch cumulative error over any 10 pitches ± 0.2 mm Revision: 24-Mar-2025
2
Document Number: 29243 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000