Datasheet MMBTA42 (Nexperia) - 4
| 制造商 | Nexperia |
| 描述 | NPN high-voltage transistor |
| 页数 / 页 | 7 / 4 — Nexperia. MMBTA42. NPN high-voltage transistor. 12. Soldering. Fig. 2. … |
| 修订版 | 12202310 |
| 文件格式/大小 | PDF / 205 Kb |
| 文件语言 | 英语 |
Nexperia. MMBTA42. NPN high-voltage transistor. 12. Soldering. Fig. 2. Reflow soldering footprint for SOT23
该数据表的模型线
文件文字版本
Nexperia MMBTA42 NPN high-voltage transistor 12. Soldering
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 2. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 3. Wave soldering footprint for SOT23
MMBTA42 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved
Product data sheet 12 October 2023 4 / 7
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents
3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste occupied area 0.7 0.6 (3×) (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr
Fig. 2. Reflow soldering footprint for SOT23
2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw
Fig. 3. Wave soldering footprint for SOT23
MMBTA42 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved
Product data sheet 12 October 2023 4 / 7
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents