Datasheet MAX44260 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | 1.8V, 15MHz Low-Offset, Low-Power, Rail-to-Rail I/O Op Amps |
| 页数 / 页 | 14 / 2 — Absolute Maximum Ratings. Package Thermal Characteristics (Note 1). Note … |
| 文件格式/大小 | PDF / 1.0 Mb |
| 文件语言 | 英语 |
Absolute Maximum Ratings. Package Thermal Characteristics (Note 1). Note 1:. www.maximintegrated.com/thermal-tutorial
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MAX44259/MAX44260/ 1.8V, 15MHz Low-Offset, MAX44261/MAX44263 Low-Power, Rail-to-Rail I/O Op Amps
Absolute Maximum Ratings
IN+, IN-, OUT .. (VSS - 0.3V) to (VDD + 0.3V) SOT23 (derate 3.9mW/NC above +70NC) ...312.6mW VDD to VSS ..-0.3V to +6V 6-Pin Thin µDFN (Ultra-Thin LGA) SHDN, CAL ...-0.3V to +6V (derate 2.1mW/NC above +70NC) ...110.2mW Output to Short-Circuit Ground Duration .. 10s Operating Temperature Range .. -40NC to +125NC Continuous Input Current into Any Pin .. Q20mA Junction Temperature ...+150NC Continuous Power Dissipation (TA = +70NC) Lead Temperature (soldering, 10s) ..+300NC SC70 (derate 3.1mW/NC above +70NC) ..245mW Soldering Temperature (reflow) ..+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
SC70 Thin µDFN (Ultra-Thin LGA) Junction-to-Ambient Thermal Resistance (BJA) .. 326.5NC/W Junction-to-Ambient Thermal Resistance (BJA) ... 470NC/W Junction-to-Case Thermal Resistance (BJC) ...115NC/W SOT23 Junction-to-Ambient Thermal Resistance (BJA) .. 255.9NC/W Junction-to-Case Thermal Resistance (BJC) ...81NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VCAL = VSHDN = VDD, TA = -40NC to +125NC. Typical values are at TA = +25NC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS VDD Input Voltage Range VIN+ VIN- Guaranteed by CMRR test -0.1 V + 0.1 TA = +25NC 10 50 TA = -40°C to +125°C after calibration 100 Input Offset Voltage (Note 3) VOS FV TA = -40°C to MAX44260/MAX44261 500 +125°C MAX44259/MAX44263 800 Input Offset Voltage Drift MAX44260/MAX44261 0.8 5 V (Note 3) OS - TC FV/NC MAX44259/MAX44263 1 8 MAX44259/ 0.01 0.5 TA = +25NC MAX44260/MAX44261 MAX44263 0.01 0.5 Input Bias Current (Note 3) IB TA = -40NC to +85NC 10 pA MAX44259/ TA = -40NC to 100 MAX44260/MAX44261 +125NC MAX44263 160 Input Capacitance CIN 0.4 pF Common-Mode Rejection Ratio CMRR VCM = -0.1V to (VDD + 0.1V) 75 90 dB V Common mode CM = -0.1V to 1011 Input Resistance RIN (VDD + 0.1V) Ω Differential mode 1012 www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
IN+, IN-, OUT .. (VSS - 0.3V) to (VDD + 0.3V) SOT23 (derate 3.9mW/NC above +70NC) ...312.6mW VDD to VSS ..-0.3V to +6V 6-Pin Thin µDFN (Ultra-Thin LGA) SHDN, CAL ...-0.3V to +6V (derate 2.1mW/NC above +70NC) ...110.2mW Output to Short-Circuit Ground Duration .. 10s Operating Temperature Range .. -40NC to +125NC Continuous Input Current into Any Pin .. Q20mA Junction Temperature ...+150NC Continuous Power Dissipation (TA = +70NC) Lead Temperature (soldering, 10s) ..+300NC SC70 (derate 3.1mW/NC above +70NC) ..245mW Soldering Temperature (reflow) ..+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
SC70 Thin µDFN (Ultra-Thin LGA) Junction-to-Ambient Thermal Resistance (BJA) .. 326.5NC/W Junction-to-Ambient Thermal Resistance (BJA) ... 470NC/W Junction-to-Case Thermal Resistance (BJC) ...115NC/W SOT23 Junction-to-Ambient Thermal Resistance (BJA) .. 255.9NC/W Junction-to-Case Thermal Resistance (BJC) ...81NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VCAL = VSHDN = VDD, TA = -40NC to +125NC. Typical values are at TA = +25NC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS VDD Input Voltage Range VIN+ VIN- Guaranteed by CMRR test -0.1 V + 0.1 TA = +25NC 10 50 TA = -40°C to +125°C after calibration 100 Input Offset Voltage (Note 3) VOS FV TA = -40°C to MAX44260/MAX44261 500 +125°C MAX44259/MAX44263 800 Input Offset Voltage Drift MAX44260/MAX44261 0.8 5 V (Note 3) OS - TC FV/NC MAX44259/MAX44263 1 8 MAX44259/ 0.01 0.5 TA = +25NC MAX44260/MAX44261 MAX44263 0.01 0.5 Input Bias Current (Note 3) IB TA = -40NC to +85NC 10 pA MAX44259/ TA = -40NC to 100 MAX44260/MAX44261 +125NC MAX44263 160 Input Capacitance CIN 0.4 pF Common-Mode Rejection Ratio CMRR VCM = -0.1V to (VDD + 0.1V) 75 90 dB V Common mode CM = -0.1V to 1011 Input Resistance RIN (VDD + 0.1V) Ω Differential mode 1012 www.maximintegrated.com Maxim Integrated │ 2