Datasheet TDA7056A (NXP) - 8
| 制造商 | NXP |
| 描述 | 3 W BTL mono audio output amplifier with DC volume control |
| 页数 / 页 | 11 / 8 — PACKAGE OUTLINE. SIL9MPF: plastic single in-line medium power package … |
| 文件格式/大小 | PDF / 90 Kb |
| 文件语言 | 英语 |
PACKAGE OUTLINE. SIL9MPF: plastic single in-line medium power package with fin; 9 leads. SOT110-1
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NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control
PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
D D1 q P A P 1 2 A 3 q 2 q 1 A A 4 E pin 1 index seating plane c L 1 9 Z e b Q b w M 2 b 1 0 5 10 mm scale
DIMENSIONS (mm are the original dimensions) A (1) UNIT A 2 A A b b c D(1) E(1) Z e L P P Q q w max. 3 b 4 1 D 2 1 1 q1 q2 max.
18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 mm 3.7 2.54 0.25 1 17.8 8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20 3.4 2.50 3.2 1.55 14.9 4.2 5.7
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
95-02-25 SOT110-1 03-03-12 July 1994 8 Document Outline Features General description Missing Current Limiter (MCL) Quick reference data Ordering information Pinning Functional description Limiting values Thermal resistance Characteristics Application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Disclaimers
PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
D D1 q P A P 1 2 A 3 q 2 q 1 A A 4 E pin 1 index seating plane c L 1 9 Z e b Q b w M 2 b 1 0 5 10 mm scale
DIMENSIONS (mm are the original dimensions) A (1) UNIT A 2 A A b b c D(1) E(1) Z e L P P Q q w max. 3 b 4 1 D 2 1 1 q1 q2 max.
18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 mm 3.7 2.54 0.25 1 17.8 8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20 3.4 2.50 3.2 1.55 14.9 4.2 5.7
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
95-02-25 SOT110-1 03-03-12 July 1994 8 Document Outline Features General description Missing Current Limiter (MCL) Quick reference data Ordering information Pinning Functional description Limiting values Thermal resistance Characteristics Application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Disclaimers