Datasheet TPS62933 (Texas Instruments) - 6
| 制造商 | Texas Instruments |
| 描述 | 3.8-V to 30-V, 3-A, 200-kHz to 2.2-MHz, low-IQ synchronous buck converter in SOT-583 package |
| 页数 / 页 | 51 / 6 — TPS62933,. TPS62932. , TPS62933F, TPS62933P, TPS62933O. www.ti.com. 8.4 … |
| 文件格式/大小 | PDF / 4.0 Mb |
| 文件语言 | 英语 |
TPS62933,. TPS62932. , TPS62933F, TPS62933P, TPS62933O. www.ti.com. 8.4 Thermal Information. TPS6293x. THERMAL METRIC
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TPS62933, TPS62932 , TPS62933F, TPS62933P, TPS62933O
SLUSEA4D – JUNE 2021 – REVISED AUGUST 2022
www.ti.com 8.4 Thermal Information TPS6293x THERMAL METRIC
(1)
DRL (SOT583), 8 PINS UNIT JEDEC
(2)
EVM
(3) RθJA Junction-to-ambient thermal resistance 112.2 N/A °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.1 N/A °C/W RθJB Junction-to-board thermal resistance 19.3 N/A °C/W ΨJT Junction-to-top characterization parameter 1.6 N/A °C/W ΨJB Junction-to-board characterization parameter 19.2 N/A °C/W Junction-to-ambient thermal resistance on official RθJA_EVM N/A 60.2 °C/W EVM board (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. They do not represent the performance obtained in an actual application. (3) The real RθJA is tested on TI EVM (2 layer, 2-ounce copper thickness).
8.5 Electrical Characteristics
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. These specifications are interpreted as conditions that do not degrade the device parametric or functional specifications for the life of the product containing it. TJ = –40°C to +150°C, VIN = 3.8 V to 30 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY (VIN PIN)
VIN Operation input voltage 3.8 30 V EN = 5 V, VFB = 0.85 V, TPS62932, 12 TPS62933, and TPS62933P IQ Nonswitching quiescent current µA EN = 5 V, VFB = 1 V, TPS62933F 125 EN = 5 V, VFB = 1 V, TPS62933O 45 ISHDN Shutdown supply current VEN = 0 V 2 µA Rising threshold 3.4 3.6 3.8 V Input undervoltage lockout VIN_UVLO Falling threshold 3.1 3.3 3.5 V thresholds Hysteresis 300 mV
ENABLE (EN PIN)
VEN_RISE Enable threshold Rising enable threshold 1.21 1.28 V VEN_FALL Disable threshold Falling disable threshold 1.1 1.17 V Ip EN pullup current VEN = 1.0 V 0.7 µA Ih EN pullup hysteresis current VEN = 1.5 V 1.4 µA
VOLTAGE REFERENCE (FB PIN)
TJ = 25°C 792 800 808 mV VFB FB voltage TJ = 0°C to 85°C 788 800 812 mV TJ = –40°C to 150°C 784 800 816 mV IFB Input leakage current VFB = 0.8 V 0.15 μA
INTEGRATED POWER MOSFETS
RDSON_HS High-side MOSFET on-resistance TJ = 25°C, VBST – SW = 5 V 76 mΩ RDSON_LS Low-side MOSFET on-resistance TJ = 25°C 32 mΩ
CURRENT LIMIT
TPS62933 and TPS62933x 4.2 5 5.8 IHS_LIMIT High-side MOSFET current limit A TPS62932 2.8 3.4 4 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS62933 TPS62932 TPS62933F TPS62933P TPS62933O Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Device Comparison Table 7 Pin Configuration and Functions 8 Specifications 8.1 Absolute Maximum Ratings 8.2 ESD Ratings 8.3 Recommended Operating Conditions 8.4 Thermal Information 8.5 Electrical Characteristics 8.6 Typical Characteristics 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Fixed Frequency Peak Current Mode 9.3.2 Pulse Frequency Modulation 9.3.3 Voltage Reference 9.3.4 Output Voltage Setting 9.3.5 Switching Frequency Selection 9.3.6 Enable and Adjusting Undervoltage Lockout 9.3.7 External Soft Start and Prebiased Soft Start 9.3.8 Power Good 9.3.9 Minimum On Time, Minimum Off Time, and Frequency Foldback 9.3.10 Frequency Spread Spectrum 9.3.11 Overvoltage Protection 9.3.12 Overcurrent and Undervoltage Protection 9.3.13 Thermal Shutdown 9.4 Device Functional Modes 9.4.1 Modes Overview 9.4.2 Heavy Load Operation 9.4.3 Light Load Operation 9.4.4 Out of Audio Operation 9.4.5 Forced Continuous Conduction Operation 9.4.6 Dropout Operation 9.4.7 Minimum On-Time Operation 9.4.8 Shutdown Mode 10 Application and Implementation 10.1 Application Information 10.2 Typical Application 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Custom Design With WEBENCH® Tools 10.2.2.2 Output Voltage Resistors Selection 10.2.2.3 Choosing Switching Frequency 10.2.2.4 Soft-Start Capacitor Selection 10.2.2.5 Bootstrap Capacitor Selection 10.2.2.6 Undervoltage Lockout Setpoint 10.2.2.7 Output Inductor Selection 10.2.2.8 Output Capacitor Selection 10.2.2.9 Input Capacitor Selection 10.2.2.10 Feedforward Capacitor CFF Selection 10.2.2.11 Maximum Ambient Temperature 10.2.3 Application Curves 10.3 What to Do and What Not to Do 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Device Support 13.1.1 Third-Party Products Disclaimer 13.1.2 Development Support 13.1.2.1 Custom Design With WEBENCH® Tools 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information
TPS62933, TPS62932 , TPS62933F, TPS62933P, TPS62933O
SLUSEA4D – JUNE 2021 – REVISED AUGUST 2022
www.ti.com 8.4 Thermal Information TPS6293x THERMAL METRIC
(1)
DRL (SOT583), 8 PINS UNIT JEDEC
(2)
EVM
(3) RθJA Junction-to-ambient thermal resistance 112.2 N/A °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.1 N/A °C/W RθJB Junction-to-board thermal resistance 19.3 N/A °C/W ΨJT Junction-to-top characterization parameter 1.6 N/A °C/W ΨJB Junction-to-board characterization parameter 19.2 N/A °C/W Junction-to-ambient thermal resistance on official RθJA_EVM N/A 60.2 °C/W EVM board (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. They do not represent the performance obtained in an actual application. (3) The real RθJA is tested on TI EVM (2 layer, 2-ounce copper thickness).
8.5 Electrical Characteristics
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. These specifications are interpreted as conditions that do not degrade the device parametric or functional specifications for the life of the product containing it. TJ = –40°C to +150°C, VIN = 3.8 V to 30 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY (VIN PIN)
VIN Operation input voltage 3.8 30 V EN = 5 V, VFB = 0.85 V, TPS62932, 12 TPS62933, and TPS62933P IQ Nonswitching quiescent current µA EN = 5 V, VFB = 1 V, TPS62933F 125 EN = 5 V, VFB = 1 V, TPS62933O 45 ISHDN Shutdown supply current VEN = 0 V 2 µA Rising threshold 3.4 3.6 3.8 V Input undervoltage lockout VIN_UVLO Falling threshold 3.1 3.3 3.5 V thresholds Hysteresis 300 mV
ENABLE (EN PIN)
VEN_RISE Enable threshold Rising enable threshold 1.21 1.28 V VEN_FALL Disable threshold Falling disable threshold 1.1 1.17 V Ip EN pullup current VEN = 1.0 V 0.7 µA Ih EN pullup hysteresis current VEN = 1.5 V 1.4 µA
VOLTAGE REFERENCE (FB PIN)
TJ = 25°C 792 800 808 mV VFB FB voltage TJ = 0°C to 85°C 788 800 812 mV TJ = –40°C to 150°C 784 800 816 mV IFB Input leakage current VFB = 0.8 V 0.15 μA
INTEGRATED POWER MOSFETS
RDSON_HS High-side MOSFET on-resistance TJ = 25°C, VBST – SW = 5 V 76 mΩ RDSON_LS Low-side MOSFET on-resistance TJ = 25°C 32 mΩ
CURRENT LIMIT
TPS62933 and TPS62933x 4.2 5 5.8 IHS_LIMIT High-side MOSFET current limit A TPS62932 2.8 3.4 4 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS62933 TPS62932 TPS62933F TPS62933P TPS62933O Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Device Comparison Table 7 Pin Configuration and Functions 8 Specifications 8.1 Absolute Maximum Ratings 8.2 ESD Ratings 8.3 Recommended Operating Conditions 8.4 Thermal Information 8.5 Electrical Characteristics 8.6 Typical Characteristics 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Fixed Frequency Peak Current Mode 9.3.2 Pulse Frequency Modulation 9.3.3 Voltage Reference 9.3.4 Output Voltage Setting 9.3.5 Switching Frequency Selection 9.3.6 Enable and Adjusting Undervoltage Lockout 9.3.7 External Soft Start and Prebiased Soft Start 9.3.8 Power Good 9.3.9 Minimum On Time, Minimum Off Time, and Frequency Foldback 9.3.10 Frequency Spread Spectrum 9.3.11 Overvoltage Protection 9.3.12 Overcurrent and Undervoltage Protection 9.3.13 Thermal Shutdown 9.4 Device Functional Modes 9.4.1 Modes Overview 9.4.2 Heavy Load Operation 9.4.3 Light Load Operation 9.4.4 Out of Audio Operation 9.4.5 Forced Continuous Conduction Operation 9.4.6 Dropout Operation 9.4.7 Minimum On-Time Operation 9.4.8 Shutdown Mode 10 Application and Implementation 10.1 Application Information 10.2 Typical Application 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Custom Design With WEBENCH® Tools 10.2.2.2 Output Voltage Resistors Selection 10.2.2.3 Choosing Switching Frequency 10.2.2.4 Soft-Start Capacitor Selection 10.2.2.5 Bootstrap Capacitor Selection 10.2.2.6 Undervoltage Lockout Setpoint 10.2.2.7 Output Inductor Selection 10.2.2.8 Output Capacitor Selection 10.2.2.9 Input Capacitor Selection 10.2.2.10 Feedforward Capacitor CFF Selection 10.2.2.11 Maximum Ambient Temperature 10.2.3 Application Curves 10.3 What to Do and What Not to Do 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Device Support 13.1.1 Third-Party Products Disclaimer 13.1.2 Development Support 13.1.2.1 Custom Design With WEBENCH® Tools 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information