Datasheet TMUX1204 (Texas Instruments) - 4

TMUX1204
SCDS393A – APRIL 2019 – REVISED OCTOBER 2019
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN MAX UNIT
VDD Supply voltage –0.5 6 V VSEL or VEN Logic control input pin voltage (EN, A0, A1) –0.5 6 V ISEL or IEN Logic control input pin current (EN, A0, A1) –30 30 mA VS or VD Source or drain voltage (Sx, D) –0.5 VDD+0.5 V IS or ID (CONT) Source or drain continuous current (Sx, D) –30 30 mA Tstg Storage temperature –65 150 °C TJ Junction temperature 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (3) All voltages are with respect to ground, unless otherwise specified.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101 or ANSI/ESDA/JEDEC JS-002, all pins(2) ±750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Positive power supply voltage 1.08 5.5 V VS or VD Signal path input/output voltage (source or drain pin) (Sx, D) 0 VDD V VSEL or Logic control input pin voltage (EN, A0, A1) 0 5.5 V VEN TA Ambient temperature –40 125 °C
6.4 Thermal Information TMUX1204 THERMAL METRIC(1) DGS (VSSOP) DQA (USON) UNIT 10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 193.9 173.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 83.1 99.7 °C/W RθJB Junction-to-board thermal resistance 116.5 73.5 °C/W ΨJT Junction-to-top characterization parameter 22.0 8.9 °C/W ΨJB Junction-to-board characterization parameter 114.6 73.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TMUX1204 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics (VDD = 5 V ±10 %) 6.6 Electrical Characteristics (VDD = 3.3 V ±10 %) 6.7 Electrical Characteristics (VDD = 1.8 V ±10 %) 6.8 Electrical Characteristics (VDD = 1.2 V ±10 %) 6.9 Typical Characteristics 7 Parameter Measurement Information 7.1 On-Resistance 7.2 Off-Leakage Current 7.3 On-Leakage Current 7.4 Transition Time 7.5 Break-Before-Make 7.6 tON(EN) and tOFF(EN) 7.7 Charge Injection 7.8 Off Isolation 7.9 Crosstalk 7.10 Bandwidth 8 Detailed Description 8.1 Functional Block Diagram 8.2 Feature Description 8.2.1 Bidirectional Operation 8.2.2 Rail to Rail Operation 8.2.3 1.8 V Logic Compatible Inputs 8.2.4 Fail-Safe Logic 8.3 Device Functional Modes 8.4 Truth Tables 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.3 Design Requirements 9.4 Detailed Design Procedure 9.5 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.1.1 Layout Information 11.2 Layout Example 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Receiving Notification of Documentation Updates 12.3 Community Resources 12.4 Trademarks 12.5 Electrostatic Discharge Caution 12.6 Glossary 13 Mechanical, Packaging, and Orderable Information