Datasheet LF155, LF156, LF256, LF257 LF355, LF356, LF357 (Texas Instruments) - 6

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描述LFx5x J FET Input Operational Amplifiers
页数 / 页46 / 6 — LF155, LF156. , LF256,. LF257 LF355, LF356,. LF357. www.ti.com. 6.6 DC …
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LF155, LF156. , LF256,. LF257 LF355, LF356,. LF357. www.ti.com. 6.6 DC Electrical Characteristics, TA = TJ = 25°C, VS = ±15 V

LF155, LF156 , LF256, LF257 LF355, LF356, LF357 www.ti.com 6.6 DC Electrical Characteristics, TA = TJ = 25°C, VS = ±15 V

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LF155, LF156 , LF256, LF257 LF355, LF356, LF357
SNOSBH0D – MAY 2000 – REVISED NOVEMBER 2015
www.ti.com 6.6 DC Electrical Characteristics, TA = TJ = 25°C, VS = ±15 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LF155 2 4 LF355 2 4 Supply current LFx56, LF356B 5 7 mA LF356 5 10 LF357 5 10
6.7 DC Electrical Characteristics
See (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LF15x, LF25x, LF356B 3 5 TA = 25°C LF35x 3 10 VOS Input offset voltage RS = 50 Ω LF15x 7 mV Over LF25x, LF356B 6.5 temperature LF35x 13 Average TC of input ΔVOS/ΔT RS = 50 Ω LF15x, LF25x, LF356B, LF35x 5 μV/°C offset voltage Change in average TC μV/°C ΔTC/ΔVOS RS = 50 Ω(2) LF15x, LF25x, LF356B, LF35x 0.5 with VOS adjust per mV LF15x, LF25x, LF356B 3 20 TJ = 25°C(1) (3) pA LF35x 3 50 IOS Input offset current LF15x 20 TJ ≤ THIGH LF25x, LF356B 1 nA LF35x 2 LF15x, LF25x, LF356B 30 100 TJ = 25°C(1) (3) pA LF35x 30 200 IB Input bias current LF15x 50 TJ ≤ THIGH LF25x, LF356B 5 nA LF35x 8 RIN Input resistance TJ = 25°C LF15x, LF25x, LF356B, LF35x 1012 Ω LF15x, LF25x, LF356B 50 200 TA = 25°C VS = ±15 V, LF35x 25 200 AVOL Large signal voltage gain VO = ±10 V, V/mV LF15x, LF25x, LF356B 25 R Over L = 2 kΩ temperature LF35x 15 VS = ±15 V, RL = 10 kΩ LF15x, LF25x, LF356B, LF35x ±12 ±13 VO Output voltage swing V VS = ±15 V, RL= 2 kΩ LF15x, LF25x, LF356B, LF35x ±10 ±12 (1) Unless otherwise stated, these test conditions apply: LF15x LF25x LF356B LF35x Supply Voltage, VS ±15 V ≤ VS ≤ ±20 V ±15 V ≤ VS ≤ ±20 V ±15 V ≤ VS ≤ ±20 V VS = ±15 V TA −55°C ≤ TA ≤ +125°C −25°C ≤ TA ≤ +85°C 0°C ≤ TA ≤ +70°C 0°C ≤ TA ≤ +70°C THIGH +125°C +85°C +70°C +70°C and VOS, IB and IOS are measured at VCM = 0. (2) The Temperature Coefficient of the adjusted input offset voltage changes only a small amount (0.5 μV/°C typically) for each mV of adjustment from its original unadjusted value. Common-mode rejection and open-loop voltage gain are also unaffected by offset adjustment. (3) The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junction temperature, TJ. Due to limited production test time, the input bias currents measured are correlated to junction temperature. In normal operation the junction temperature rises above the ambient temperature as a result of internal power dissipation, Pd. TJ = TA + θJA Pd where θJA is the thermal resistance from junction to ambient. Use of a heat sink is recommended if input bias current is to be kept to a minimum. 6 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated LF156 LF256 LF356 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 AC Electrical Characteristics, TA = TJ = 25°C, VS = ±15 V 6.6 DC Electrical Characteristics, TA = TJ = 25°C, VS = ±15 V 6.7 DC Electrical Characteristics 6.8 Power Dissipation Ratings 6.9 Typical Characteristics 6.9.1 Typical DC Performance Characteristics 6.9.2 Typical AC Performance Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Large Differential Input Voltage 7.3.2 Large Common-Mode Input Voltage 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.3 Application Curves 8.3 System Examples 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.1.1 Printed-Circuit-Board Layout For High-Impedance Work 10.2 Layout Example 11 Device and Documentation Support 11.1 Related Links 11.2 Community Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information