Datasheet ADuM4165, ADuM4166 (Analog Devices) - 9

制造商Analog Devices
描述5.7 kV RMS Digital Isolators for Isolated USB 2.0 High, Full, and Low Speed
页数 / 页26 / 9 — ADuM4165/ADuM4166. ABSOLUTE MAXIMUM RATINGS. Table 8. THERMAL RESISTANCE. …
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ADuM4165/ADuM4166. ABSOLUTE MAXIMUM RATINGS. Table 8. THERMAL RESISTANCE. Parameter. Rating. Table 9. Thermal Resistance

ADuM4165/ADuM4166 ABSOLUTE MAXIMUM RATINGS Table 8 THERMAL RESISTANCE Parameter Rating Table 9 Thermal Resistance

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ADuM4165/ADuM4166 ABSOLUTE MAXIMUM RATINGS Table 8. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to PCB design and operation Supply (VBUS1, VDD1) to GND1 −0.5 V to +6.5 V environment. Close attention to PCB thermal design is required. Supply (VBUS2, VDD2) to GND2 −0.5 V to +6.5 V Upstream Input Voltage (UD−, UD+, XI θ 1, and −0.5 V to VDD1 + 0.5 V JA is the natural convection, junction to ambient thermal resistance XO measured in a one cubic foot sealed enclosure. Ψ 1) to GND1 JT is the junction Downstream Input Voltage (DD−, DD+, XI to top thermal characterization parameter. 2, −0.5 V to VDD2 + 0.5 V XO2, and PGOOD) to GND2
Table 9. Thermal Resistance
Common-Mode Transients1 −100 kV/µs to +100 kV/µs
Package Type1 θ
Temperature
JA ΨJT Unit
RI-20-1 50 2.3 °C/W Operating Range −55°C to +125°C Storage Range −65°C to +150°C 1 Test Condition 1: thermal impedance simulated with 4-layer standard JEDEC Junction (TJ Maximum) 150°C PCB. Power Dissipation2 (TJ maximum − TA)/θJA 1 Refers to common-mode transients across the insulation barrier. Common- mode transients exceeding the absolute maximum ratings may cause latch-up or permanent damage. 2 See Figure 3 for the maximum power dissipation for various temperatures. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability.
Table 10. Maximum Continuous Working Voltage1 Parameter Rating Constraint
AC Voltage Bipolar Waveform Basic Insulation 650 V rms Basic insulation rating per IEC60747-17. Accumulative failure rate over lifetime (FROL) ≤ 1000 ppm at 20 years. Reinforced Insulation 600 V rms Reinforced insulation rating per IEC60747-17. Accumulative FROL ≤ 1 ppm at 26 years. Unipolar Waveform Basic Insulation 1838 VPEAK Rating limited by AC bipolar waveform accumulative FROL ≤ 1000 ppm at 20 years. Reinforced Insulation 1355 VPEAK Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. DC Voltage Basic Insulation 1660 V dc Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. Reinforced Insulation 830 V dc Rating limited by package creepage per IEC 60664-1 in Pollution Degree 2 environment. 1 Maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier in a Pollution Degree 2 environment. See the Insulation Lifetime section for more details.
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Document Outline Features Applications Functional Block Diagrams General Description Specifications Timing Specifications Insulation and Safety Related Specifications Package Characteristics Regulatory Information DIN V VDE V 0884-11 (VDE V 0884-11) Insulation Characteristics (Pending) Recommended Operating Conditions Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for ADuM4165/ADuM4166 ESD Caution Pin Configurations and Function Descriptions Truth Tables Typical Performance Characteristics Terminology Bus Upstream and Downstream Hub Host Peripheral Enumeration Low Speed Full Speed High Speed End of Packet (EOP) J State K State SE0 State SE1 State Idle L1 Suspend L2 Suspend Theory of Operation Automatic Data Transfer and Modes Retimer and Other Features Isolator Characteristics and Low Power Modes Applications Information Power Supply Options Clock Options PGOOD, Clock, and Power Sequencing Isolated USB Implementations Peripheral Applications Host Applications Interface Applications PCB Layout and Electromagnetic Interference (EMI) Insulation Lifetime Surface Tracking Insulation Wear Out Calculation and Use of Parameters Example Outline Dimensions Ordering Guide Evaluation Boards