Datasheet EFM8SB1 (Silicon Labs) - 3

制造商Silicon Labs
描述EFM8 Sleepy Bee Family
页数 / 页71 / 3 — 2. Ordering Information. EFM8 SB1 0 F 8 G – A – QSOP24 R. Tape and Reel …
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2. Ordering Information. EFM8 SB1 0 F 8 G – A – QSOP24 R. Tape and Reel (Optional). Package Type. Revision

2 Ordering Information EFM8 SB1 0 F 8 G – A – QSOP24 R Tape and Reel (Optional) Package Type Revision

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EFM8SB1 Data Sheet Ordering Information
2. Ordering Information EFM8 SB1 0 F 8 G – A – QSOP24 R Tape and Reel (Optional) Package Type Revision Temperature Grade G (-40 to +85), A (-40 to +85, Automotive Grade) Flash Memory Size – 8 KB Memory Type (Flash) Family Feature Set Sleepy Bee 1 Family Silicon Labs EFM8 Product Line Figure 2.1. EFM8SB1 Part Numbering
All EFM8SB1 family members have the following features: • CIP-51 Core running up to 25 MHz • Three Internal Oscillators (24.5 MHz, 20 MHz, and 16 kHz) • SMBus / I2C • SPI • UART • 3-Channel Programmable Counter Array (PWM, Clock Generation, Capture/Compare) • 4 16-bit Timers • Analog Comparator • 6-bit current sourc reference • 12-bit Analog-to-Digital Converter with integrated multiplexer, voltage reference, and temperature sensor • 16-bit CRC Unit • AEC-Q100 qualified (Grade 3) • Pre-loaded UART bootloader In addition to these features, each part number in the EFM8SB1 family has a set of features that vary across the product line. The product selection guide shows the features available on each family member.
Table 2.1. Product Selection Guide Ordering Part Number Flash Memory (kB) RAM (Bytes) Digital Port I/Os (Total) ADC0 Channels Capacitive Touch Inputs Pb-free (RoHS Compliant) Temperature Range Package
EFM8SB10F8G-A-QSOP24 8 512 17 10 14 Yes -40 to +85 C QSOP24 EFM8SB10F8G-A-QFN24 8 512 17 10 14 Yes -40 to +85 C QFN24 EFM8SB10F8G-A-QFN20 8 512 16 9 13 Yes -40 to +85 C QFN20G EFM8SB10F8G-A-CSP16 8 512 13 9 12 Yes -40 to +85 C CSP16 EFM8SB10F4G-A-QFN20 4 512 16 9 13 Yes -40 to +85 C QFN20G
silabs.com
| Building a more connected world. Rev. 1.4 | 2 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Power 3.3 I/O 3.4 Clocking 3.5 Counters/Timers and PWM 3.6 Communications and Other Digital Peripherals 3.7 Analog 3.8 Reset Sources 3.9 Debugging 3.10 Bootloader 4. Electrical Specifications 4.1 Electrical Characteristics 4.1.1 Recommended Operating Conditions 4.1.2 Power Consumption 4.1.3 Reset and Supply Monitor 4.1.4 Flash Memory 4.1.5 Power Management Timing 4.1.6 Internal Oscillators 4.1.7 Crystal Oscillator 4.1.8 External Clock Input 4.1.9 ADC 4.1.10 Voltage Reference 4.1.11 Temperature Sensor 4.1.12 Comparators 4.1.13 Programmable Current Reference (IREF0) 4.1.14 Capacitive Sense (CS0) 4.1.15 Port I/O 4.1.16 SMBus 4.2 Thermal Conditions 4.3 Absolute Maximum Ratings 4.4 Typical Performance Curves 5. Typical Connection Diagrams 5.1 Power 5.2 Debug 5.3 Other Connections 6. Pin Definitions 6.1 EFM8SB1x-QFN20 Pin Definitions 6.2 EFM8SB1x-QFN24 Pin Definitions 6.3 EFM8SB1x-QSOP24 Pin Definitions 6.4 EFM8SB1x-CSP16 Pin Definitions 7. CSP16 Package Specifications 7.1 CSP16 Package Dimensions 7.2 CSP16 PCB Land Pattern 7.3 CSP16 Package Marking 8. QFN20G Package Specifications 8.1 QFN20 Package Dimensions 8.2 QFN20 PCB Land Pattern 8.3 QFN20 Package Marking 9. QFN20A Package Specifications 9.1 QFN20 Package Dimensions 9.2 QFN20 PCB Land Pattern 9.3 QFN20 Package Marking 10. QFN24 Package Specifications 10.1 QFN24 Package Dimensions 10.2 QFN24 PCB Land Pattern 10.3 QFN24 Package Marking 11. QSOP24 Package Specifications 11.1 QSOP24 Package Dimensions 11.2 QSOP24 PCB Land Pattern 11.3 QSOP24 Package Marking 12. Revision History 12.1 Revision 1.4 12.2 Revision 1.3 12.3 Revision 1.2 12.4 Revision 1.1 Table of Contents