Datasheet 2N5087 (ON Semiconductor) - 2
| 制造商 | ON Semiconductor |
| 描述 | Amplifier Transistor PNP Silicon |
| 页数 / 页 | 8 / 2 — PNP Silicon. Features. http://onsemi.com. MAXIMUM RATINGS. Rating. … |
| 修订版 | 5 |
| 文件格式/大小 | PDF / 259 Kb |
| 文件语言 | 英语 |
PNP Silicon. Features. http://onsemi.com. MAXIMUM RATINGS. Rating. Symbol. Value. Unit. TO−92. CASE 29. STYLE 1. THERMAL CHARACTERISTICS
该数据表的模型线
文件文字版本
2N5087 Amplifier Transistor
PNP Silicon Features
• These are Pb−Free Devices*
http://onsemi.com
3 COLLECTOR
MAXIMUM RATINGS
2
Rating Symbol Value Unit
BASE Collector−Emitter Voltage VCEO 50 Vdc 1 EMITTER Collector−Base Voltage VCBO 50 Vdc Emitter−Base Voltage VEBO 3.0 Vdc Collector Current − Continuous IC 50 mAdc
TO−92
Total Device Dissipation @ TA = 25°C PD 625 mW
CASE 29
Derate above 25°C 5.0 mW/°C
STYLE 1
Total Device Dissipation @ TC = 25°C PD 1.5 W Derate above 25°C 12 mW/°C 1 1 2 2 3 3 Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL
THERMAL CHARACTERISTICS
AMMO PACK
Characteristic Symbol Max Unit MARKING DIAGRAM
Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W 2N Stresses exceeding Maximum Ratings may damage the device. Maximum 5087 Ratings are stress ratings only. Functional operation above the Recommended AYWW G Operating Conditions is not implied. Extended exposure to stresses above the G Recommended Operating Conditions may affect device reliability. A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION Device Package Shipping
† 2N5087G TO−92 5000 Units / Bulk (Pb−Free) 2N5087RLRAG TO−92 2000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 5 2N5087/D
PNP Silicon Features
• These are Pb−Free Devices*
http://onsemi.com
3 COLLECTOR
MAXIMUM RATINGS
2
Rating Symbol Value Unit
BASE Collector−Emitter Voltage VCEO 50 Vdc 1 EMITTER Collector−Base Voltage VCBO 50 Vdc Emitter−Base Voltage VEBO 3.0 Vdc Collector Current − Continuous IC 50 mAdc
TO−92
Total Device Dissipation @ TA = 25°C PD 625 mW
CASE 29
Derate above 25°C 5.0 mW/°C
STYLE 1
Total Device Dissipation @ TC = 25°C PD 1.5 W Derate above 25°C 12 mW/°C 1 1 2 2 3 3 Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL
THERMAL CHARACTERISTICS
AMMO PACK
Characteristic Symbol Max Unit MARKING DIAGRAM
Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W 2N Stresses exceeding Maximum Ratings may damage the device. Maximum 5087 Ratings are stress ratings only. Functional operation above the Recommended AYWW G Operating Conditions is not implied. Extended exposure to stresses above the G Recommended Operating Conditions may affect device reliability. A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION Device Package Shipping
† 2N5087G TO−92 5000 Units / Bulk (Pb−Free) 2N5087RLRAG TO−92 2000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 5 2N5087/D