Datasheet FDS6679 (Fairchild) - 3

制造商Fairchild
描述30 Volt P-Channel PowerTrench MOSFET
页数 / 页6 / 3 — Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ …
文件格式/大小PDF / 215 Kb
文件语言英语

Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ Max Units Off Characteristics. BVDSS. ∆BVDSS. ∆TJ

Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ Max Units Off Characteristics BVDSS ∆BVDSS ∆TJ

该数据表的模型线

文件文字版本

Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ Max Units Off Characteristics
BVDSS
∆BVDSS
∆TJ
IDSS Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient VGS = 0 V, ID = –250 µA Zero Gate Voltage Drain Current VDS = –24 V, VGS = 0 V –1 µA IGSS Gate–Body Leakage VGS = ±25 V, VDS = 0 V ±100 nA –3 V On Characteristics
VGS(th) –30 ID = –250 µA, Referenced to 25°C V
–23 mV/°C (Note 2) VDS = VGS, ID = –250 µA
ID = –250 µA, Referenced to 25°C –1 –1.6 ∆VGS(th)
∆TJ
RDS(on) Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance ID(on) On–State Drain Current VGS = –10 V,
ID = –13 A
ID = –11 A
VGS = –4.5 V,
VGS=–10 V, ID =–13 A, TJ=125°C
VGS = –10 V,
VDS = –5 V gFS Forward Transconductance VDS = –5 V, ID = –13 A 44 S VDS = –15 V,
f = 1.0 MHz V GS = 0 V, 3939 pF 972 pF 498 pF 5
7.3
10
9.5 mV/°C
9
13
13 –50 mΩ A Dynamic Characteristics
Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Switching Characteristics
td(on) Turn–On Delay Time tr Turn–On Rise Time (Note 2) VDD = –15 V,
VGS = –10 V, ID = –1 A,
RGEN = 6 Ω 19 34 ns 10 20 ns td(off) Turn–Off Delay Time 110 176 ns tf Turn–Off Fall Time 65 104 ns 71 100 Qg Total Gate Charge Qgs Gate–Source Charge Qgd Gate–Drain Charge VDS = –15 V,
VGS = –10 V ID = –13 A, nC 12 nC 15 nC Drain–Source Diode Characteristics and Maximum Ratings
IS
VSD Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
VGS = 0 V, IS = –2.1 A
Voltage (Note 2) –0.7 –2.1 A –1.2 V Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°C/W (10 sec)
62.5°C/W steady state
when mounted on a
1in2 pad of 2 oz
copper b) 105°C/W when
mounted on a .04 in2
pad of 2 oz copper c) 125°C/W when mounted on a
minimum pad. Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% FDS6679 Rev C1 (W) FDS6679 Electrical Characteristics