Datasheet ADG758, ADG759 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 3 Ω, 4-/8-Channel Multiplexers in Chip Scale Package |
| 页数 / 页 | 12 / 5 — ADG758/ADG759. ABSOLUTE MAXIMUM RATINGS. Parameter Rating. ESD CAUTION. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 362 Kb |
| 文件语言 | 英语 |
ADG758/ADG759. ABSOLUTE MAXIMUM RATINGS. Parameter Rating. ESD CAUTION. Table I. ADG758 Truth Table. PIN CONFIGURATIONS. ADG758
该数据表的模型线
文件文字版本
ADG758/ADG759 ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter Rating
rating only; functional operation of the device at these or any VDD to VSS 7 V V other conditions above those indicated in the operational DD to GND –0.3 V to +7 V V section of this specification is not implied. Exposure to absolute SS to GND +0.3 V to –3.5 V Analog Inputs1 V maximum rating conditions for extended periods may affect SS – 0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First device reliability. Digital Inputs1 –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30 mA Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Chip Scale Package, 32°C/W θJA Thermal Impedance Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Table I. ADG758 Truth Table PIN CONFIGURATIONS ADG758 A2 A1 A0 EN Switch Condition TOP VIEW (Not to Scale)
X X X 0 NONE
C 0 1 2 C N A A A N
0 0 0 1 1
0 9 8 7 6 2 1 1 1 1
0 0 1 1 2 0 1 0 1 3
EN 1 15 GND V 2 14 V SS DD
0 1 1 1 4
S1 3 13 S5 S2 4 12 S6
1 0 0 1 5
S3 5 11 S7
1 0 1 1 6
6 7 8 9 0
1 1 0 1 7
1 4 D C C 8
2
S N N S
1 1 1 1 8 10 1- 37
NOTES
X = Don’t Care
02
1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS. Table II. ADG759 Truth Table ADG759 TOP VIEW A1 A0 EN ON Switch Pair (Not to Scale)
X X 0 NONE
C 0 C 1 C N A N A N 0 9 8 7 6
0 0 1 1
2 1 1 1 1
0 1 1 2
EN 1 15 GND
1 0 1 3
V 2 14 V SS DD S1A 3 13 S1B
1 1 1 4
S2A 4 12 S2B
X = Don’t Care
S3A 5 11 S3B 6 7 8 9 0 1 A A C B B 4 D 4 S N D S
-103 71 023
NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
Rev. B | Page 5
TA = 25C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter Rating
rating only; functional operation of the device at these or any VDD to VSS 7 V V other conditions above those indicated in the operational DD to GND –0.3 V to +7 V V section of this specification is not implied. Exposure to absolute SS to GND +0.3 V to –3.5 V Analog Inputs1 V maximum rating conditions for extended periods may affect SS – 0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First device reliability. Digital Inputs1 –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30 mA Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Chip Scale Package, 32°C/W θJA Thermal Impedance Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Table I. ADG758 Truth Table PIN CONFIGURATIONS ADG758 A2 A1 A0 EN Switch Condition TOP VIEW (Not to Scale)
X X X 0 NONE
C 0 1 2 C N A A A N
0 0 0 1 1
0 9 8 7 6 2 1 1 1 1
0 0 1 1 2 0 1 0 1 3
EN 1 15 GND V 2 14 V SS DD
0 1 1 1 4
S1 3 13 S5 S2 4 12 S6
1 0 0 1 5
S3 5 11 S7
1 0 1 1 6
6 7 8 9 0
1 1 0 1 7
1 4 D C C 8
2
S N N S
1 1 1 1 8 10 1- 37
NOTES
X = Don’t Care
02
1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS. Table II. ADG759 Truth Table ADG759 TOP VIEW A1 A0 EN ON Switch Pair (Not to Scale)
X X 0 NONE
C 0 C 1 C N A N A N 0 9 8 7 6
0 0 1 1
2 1 1 1 1
0 1 1 2
EN 1 15 GND
1 0 1 3
V 2 14 V SS DD S1A 3 13 S1B
1 1 1 4
S2A 4 12 S2B
X = Don’t Care
S3A 5 11 S3B 6 7 8 9 0 1 A A C B B 4 D 4 S N D S
-103 71 023
NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
Rev. B | Page 5