Datasheet ADG4612, ADG4613 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | Power-Off Protection ±5 V, +12 V, Quad SPST Switches with 5 Ω On Resistance |
| 页数 / 页 | 24 / 10 — ADG4612/ADG4613. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1. 16 … |
| 文件格式/大小 | PDF / 397 Kb |
| 文件语言 | 英语 |
ADG4612/ADG4613. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1. 16 IN2. PIN 1. ADG4612/. S1 1. INDICATOR. 12 S2. VDD. ADG4613. 11 V. GND
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文件文字版本
ADG4612/ADG4613 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 1 2 N 2 D I NI D IN1 1 16 IN2 6 5 4 3 1 1 1 1 D1 2 15 D2 S1 3 14 S2 PIN 1 ADG4612/ S1 1 INDICATOR 12 S2 V 4 13 SS VDD ADG4613 V 2 SS 11 V ADG4612/ DD GND 5 12 NC GND 3 ADG4613 10 NC TOP VIEW S4 6 (Not to Scale) 11 S3 S4 4 TOP VIEW 9 S3 (Not to Scale) D4 7 10 D3 5 6 7 8 8 9 IN4 IN3 4 4 3 3
2
D NI NI D
-00
NC = NO CONNECT
05
NOTES
3 090
1. EXPOSED PAD TIED TO SUBSTRATE, GND.
00 5-
2. NC = NO CONNECT.
00 09 Figure 2. TSSOP Pin Configuration Figure 3. LFCSP Pin Configuration
Table 8. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. This pin has an internal 400 kΩ pull-down resistor to GND. 2 16 D1 Drain Terminal 1. Can be an input or output. 3 1 S1 Source Terminal 1. Can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. Can be an input or output. 7 5 D4 Drain Terminal 4. Can be an input or output. 8 6 IN4 Logic Control Input 4. This pin has an internal 400 kΩ pull-down resistor to GND. 9 7 IN3 Logic Control Input 3. This pin has an internal 400 kΩ pull-down resistor to GND. 10 8 D3 Drain Terminal 3. Can be an input or output. 11 9 S3 Source Terminal 3. Can be an input or output. 12 10 NC No Connection. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. Can be an input or output. 15 13 D2 Drain Terminal 2. Can be an input or output. 16 14 IN2 Logic Control Input 2. This pin has an internal 400 kΩ pull-down resistor to GND. N/A 0 EPAD The exposed pad is connected to the substrate GND. For best heat dissipation, it is recommended that this pad be connected to GND. If heat dissipation is not a concern, it is possible to leave the pad floating. Connecting the exposed pad to VSS (if VSS is not equal to GND) can cause current to flow and can damage the part.
Table 9. ADG4612 Truth Table ADG4612 INx Switch Condition
1 On 0 Off
Table 10. ADG4613 Truth Table ADG4613 INx S1, S4 S2, S3
0 Off On 1 On Off Rev. 0 | Page 10 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS SPECIFICATIONS 5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, SX OR DX POWER SUPPLY OPERATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION Normal Mode Isolation Mode Positive Fault Condition Negative Fault Condition; Negative Signal Handling APPLICATIONS INFORMATION Power Supply Sequencing OUTLINE DIMENSIONS ORDERING GUIDE
2
D NI NI D
-00
NC = NO CONNECT
05
NOTES
3 090
1. EXPOSED PAD TIED TO SUBSTRATE, GND.
00 5-
2. NC = NO CONNECT.
00 09 Figure 2. TSSOP Pin Configuration Figure 3. LFCSP Pin Configuration
Table 8. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. This pin has an internal 400 kΩ pull-down resistor to GND. 2 16 D1 Drain Terminal 1. Can be an input or output. 3 1 S1 Source Terminal 1. Can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. Can be an input or output. 7 5 D4 Drain Terminal 4. Can be an input or output. 8 6 IN4 Logic Control Input 4. This pin has an internal 400 kΩ pull-down resistor to GND. 9 7 IN3 Logic Control Input 3. This pin has an internal 400 kΩ pull-down resistor to GND. 10 8 D3 Drain Terminal 3. Can be an input or output. 11 9 S3 Source Terminal 3. Can be an input or output. 12 10 NC No Connection. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. Can be an input or output. 15 13 D2 Drain Terminal 2. Can be an input or output. 16 14 IN2 Logic Control Input 2. This pin has an internal 400 kΩ pull-down resistor to GND. N/A 0 EPAD The exposed pad is connected to the substrate GND. For best heat dissipation, it is recommended that this pad be connected to GND. If heat dissipation is not a concern, it is possible to leave the pad floating. Connecting the exposed pad to VSS (if VSS is not equal to GND) can cause current to flow and can damage the part.
Table 9. ADG4612 Truth Table ADG4612 INx Switch Condition
1 On 0 Off
Table 10. ADG4613 Truth Table ADG4613 INx S1, S4 S2, S3
0 Off On 1 On Off Rev. 0 | Page 10 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS SPECIFICATIONS 5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, SX OR DX POWER SUPPLY OPERATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION Normal Mode Isolation Mode Positive Fault Condition Negative Fault Condition; Negative Signal Handling APPLICATIONS INFORMATION Power Supply Sequencing OUTLINE DIMENSIONS ORDERING GUIDE