Datasheet ADPA7002CHIP (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier |
| 页数 / 页 | 23 / 7 — Data Sheet. ADPA7002CHIP. TYPICAL PERFORMANCE CHARACTERISTICS. d ( S. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 532 Kb |
| 文件语言 | 英语 |
Data Sheet. ADPA7002CHIP. TYPICAL PERFORMANCE CHARACTERISTICS. d ( S. +85°C +25°C. S11. –55°C. S21. URN L T. S22. N ( 10. , RE. B) d. –10. N ( AI
该数据表的模型线
文件文字版本
Data Sheet ADPA7002CHIP TYPICAL PERFORMANCE CHARACTERISTICS
Where IDQ = IDD (drain current) = RF signal applied to IDQ.
20 20 18 15 16 B) 10 d ( S 14 S 5 O +85°C +25°C S11 12 B) 0 –55°C S21 d URN L T S22 N ( 10 –5 AI , RE G 8 B) d –10 6 N ( AI –15 G 4 –20 2 –25 0 14 16 18 20 22 24 28 30 32 34 36 38 40 42 44 46 48
010
20 22 24 26 28 30 32 34 36 38 40 42 44
013
FREQUENCY (GHz) FREQUENCY (GHz)
17236- 17236- Figure 10. Gain and Return Loss vs. Frequency Figure 13. Gain vs. Frequency for Various Temperatures
20 20 4.0V 600mA 5.0V 700mA 18 18 800mA 16 16 B) 14 B) 14 d d N ( N ( AI AI 12 G 12 G 10 10 8 8 6 6
1 1 0 014
20 22 24 26 28 30 32 34 36 38 40 42 44 20 22 24 26 28 30 32 34 36 38 40 42 44 FREQUENCY (GHz) FREQUENCY (GHz)
17236- 17236- Figure 11. Gain vs. Frequency for Various Drain Voltages Figure 14. Gain vs. Frequency for Various Quiescent Drain Currents
0 0 +85°C –5 +25°C –5 5.0V –55°C 4.0V B) B) d d ( ( S S S S O –10 O –10 URN L URN L T T –15 –15 RE RE UT UT INP INP –20 –20 –25 –25 20 22 24 26 28 30 32 34 36 38 40 42 44
012
20 22 24 26 28 30 32 34 36 38 40 42 44
015
FREQUENCY (GHz)
17236-
FREQUENCY (GHz)
17236- Figure 12. Input Return Loss vs. Frequency for Various Temperatures, Figure 15. Input Return Loss vs. Frequency for Various Drain Voltages VDD = 5 V, IDQ = 600 mA Rev. C | Page 7 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION ADPA7002CHIP ASSEMBLY AND CIRCUIT DIAGRAMS ALTERNATE ASSEMBLY DIAGRAM BIASING PROCEDURES BIASING THE ADPA7002CHIP WITH THE HMC980LP4E Application Circuit Setup Limiting VGATE to Meet ADPA7002CHIP VGGx AMR Requirement HMC980LP4E Bias Sequence Constant Drain Current Bias vs. Constant Gate Voltage Bias MOUNTING AND BONDING TECHNIQUES FOR MILLIMETER WAVE GAAS MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE
Where IDQ = IDD (drain current) = RF signal applied to IDQ.
20 20 18 15 16 B) 10 d ( S 14 S 5 O +85°C +25°C S11 12 B) 0 –55°C S21 d URN L T S22 N ( 10 –5 AI , RE G 8 B) d –10 6 N ( AI –15 G 4 –20 2 –25 0 14 16 18 20 22 24 28 30 32 34 36 38 40 42 44 46 48
010
20 22 24 26 28 30 32 34 36 38 40 42 44
013
FREQUENCY (GHz) FREQUENCY (GHz)
17236- 17236- Figure 10. Gain and Return Loss vs. Frequency Figure 13. Gain vs. Frequency for Various Temperatures
20 20 4.0V 600mA 5.0V 700mA 18 18 800mA 16 16 B) 14 B) 14 d d N ( N ( AI AI 12 G 12 G 10 10 8 8 6 6
1 1 0 014
20 22 24 26 28 30 32 34 36 38 40 42 44 20 22 24 26 28 30 32 34 36 38 40 42 44 FREQUENCY (GHz) FREQUENCY (GHz)
17236- 17236- Figure 11. Gain vs. Frequency for Various Drain Voltages Figure 14. Gain vs. Frequency for Various Quiescent Drain Currents
0 0 +85°C –5 +25°C –5 5.0V –55°C 4.0V B) B) d d ( ( S S S S O –10 O –10 URN L URN L T T –15 –15 RE RE UT UT INP INP –20 –20 –25 –25 20 22 24 26 28 30 32 34 36 38 40 42 44
012
20 22 24 26 28 30 32 34 36 38 40 42 44
015
FREQUENCY (GHz)
17236-
FREQUENCY (GHz)
17236- Figure 12. Input Return Loss vs. Frequency for Various Temperatures, Figure 15. Input Return Loss vs. Frequency for Various Drain Voltages VDD = 5 V, IDQ = 600 mA Rev. C | Page 7 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION ADPA7002CHIP ASSEMBLY AND CIRCUIT DIAGRAMS ALTERNATE ASSEMBLY DIAGRAM BIASING PROCEDURES BIASING THE ADPA7002CHIP WITH THE HMC980LP4E Application Circuit Setup Limiting VGATE to Meet ADPA7002CHIP VGGx AMR Requirement HMC980LP4E Bias Sequence Constant Drain Current Bias vs. Constant Gate Voltage Bias MOUNTING AND BONDING TECHNIQUES FOR MILLIMETER WAVE GAAS MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE