Datasheet ADPA7004CHIPS (Analog Devices) - 4

ADPA7004CHIPS Data Sheet 75 GHz TO 80 GHz FREQUENCY RANGE
TDIE BOTTOM = 25°C, VDD = VDD1A and VDD1B = VDD2A and VDD2B = VDD3A and VDD3B = VDD4A and VDD4B = 3.5 V, and IDQ1x + IDQ2x+ IDQ3x + IDQ4x = 550 mA, unless otherwise noted. Adjust VGG1234A from −1.5 V to 0 V to achieve the desired IDQ. The typical VGG = −0.4 V for IDQ = 550 mA.
Table 3. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE

75 80 GHz

GAIN 13 16 dB

Gain Variation over Temperature 0.023 dB/°C RETURN LOSS

Input S11 25.0 dB

Output S22 21.0 dB

OUTPUT

Output Power for 1 dB Compression P1dB 18 20.5 dBm

Saturated Output Power PSAT 22.0 dBm

Output Third-Order Intercept IP3 31.5 dBm POUT per tone = 12 dBm with 1 MHz tone spacing

SUPPLY Current IDQ 550 mA Adjust VGG to achieve IDQ = 550 mA typical Voltage VDD 3 3.5 4 V Rev. 0 | Page 4 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 40 GHz TO 45 GHz FREQUENCY RANGE 45 GHz TO 75 GHz FREQUENCY RANGE 75 GHz TO 80 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7004CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION POWER-UP AND POWER-DOWN SEQUENCING Power-Up Sequence Power-Down Sequence RF DETECTOR OPERATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE