Datasheet HMC930A (Analog Devices) - 10

制造商Analog Devices
描述GaAs, pHEMT, MMIC, 0.25 W Power Amplifier, DC to 40 GHz
页数 / 页16 / 10 — HMC930A. Data Sheet. +85°C. +25°C. 10V. –55°C. 11V. Bm). 3 (. FREQUENCY …
文件格式/大小PDF / 270 Kb
文件语言英语

HMC930A. Data Sheet. +85°C. +25°C. 10V. –55°C. 11V. Bm). 3 (. FREQUENCY (GHz). 125mA. 2GHz. 175mA. 8GHz 14GHz. 20GHz. 28GHz 34GHz. 40GHz. Bc)

HMC930A Data Sheet +85°C +25°C 10V –55°C 11V Bm) 3 ( FREQUENCY (GHz) 125mA 2GHz 175mA 8GHz 14GHz 20GHz 28GHz 34GHz 40GHz Bc)

该数据表的模型线

文件文字版本

HMC930A Data Sheet 42 42 40 40 8V 38 +85°C 38 +25°C 10V –55°C 11V 36 36 34 34 Bm) Bm) d d 3 ( 32 3 ( 32 IP IP 30 30 28 28 26 26 24 24 0 4 8 12 16 20 24 28 32 36 40
021
0 4 8 12 16 20 24 28 32 36 40
024
FREQUENCY (GHz)
13738-
FREQUENCY (GHz)
13738- Figure 21. Output IP3 vs. Frequency for Various Temperatures at Figure 24. Output IP3 vs. Frequency for Various Supply Voltages at POUT = 14 dBm/Tone POUT = 14 dBm/Tone
42 80 40 125mA 2GHz 70 175mA 8GHz 14GHz 38 20GHz 60 28GHz 34GHz 36 40GHz 50 34 Bm) Bc) d d 40 3 ( 3 ( 32 IP IM 30 30 20 28 26 10 24 0 0 4 8 12 16 20 24 28 32 36 40
022
0 2 4 6 8 10 12 14 16
025
FREQUENCY (GHz) P
13738-
OUT/TONE (dBm)
13738- Figure 22. Output IP3 vs. Frequency and Supply Current at Figure 25. Output IM3 at VDD = 8 V POUT = 14 dBm/Tone
80 80 2GHz 2GHz 70 70 8GHz 8GHz 14GHz 14GHz 20GHz 20GHz 60 60 28GHz 28GHz 34GHz 34GHz 40GHz 40GHz 50 50 Bc) Bc) d d 40 40 3 ( 3 ( IM IM 30 30 20 20 10 10 0 0 0 2 4 6 8 10 12 14 16
023
0 2 4 6 8 10 12 14 16
026
POUT/TONE (dBm) P
13738-
OUT/TONE (dBm)
13738- Figure 23. Output Third-Order Intermodulation Tone (IM3) at VDD = 10 V Figure 26. Output IM3 at VDD = 11 V Rev. A | Page 10 of 16 Document Outline Features Applications Functional Block Diagram General Description Revision History Electrical Specifications DC to 12 GHz Frequency Range 12 GHz to 32 GHz Frequency Range 32 GHz to 40 GHz Frequency Range Total Supply Current by VDD Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Wire Bonding Outline Dimensions Die Packaging Information Ordering Guide