Datasheet HMC562 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz |
| 页数 / 页 | 8 / 5 — HMC562. GaAs PHEMT MMIC WIDEBAND. DRIVER AMPLIFIER, 2 - 35 GHz. Outline … |
| 文件格式/大小 | PDF / 403 Kb |
| 文件语言 | 英语 |
HMC562. GaAs PHEMT MMIC WIDEBAND. DRIVER AMPLIFIER, 2 - 35 GHz. Outline Drawing. Die Packaging Information. 2 - 38
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HMC562
v04.1108
GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL
Die Packaging Information
[1] IN NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] A Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-2 [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD & G packaging dimensions. 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite R 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. E IV R D Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
2 - 38
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D
v04.1108
GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz Outline Drawing
2 IP H - C S R IE IF L P M K A OC BL
Die Packaging Information
[1] IN NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] A Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-2 [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD & G packaging dimensions. 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite R 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. E IV R D Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
2 - 38
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D