Datasheet HMC639ST89, 639ST89E (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | High IP3, Low Noise Amplifier, 0.2 - 4.0 GHz |
| 页数 / 页 | 6 / 4 — HMC639ST89 / 639ST89E. HIGH IP3, LOW NOISE. AMPLIFIER, 0.2 - 4.0 GHz. … |
| 文件格式/大小 | PDF / 354 Kb |
| 文件语言 | 英语 |
HMC639ST89 / 639ST89E. HIGH IP3, LOW NOISE. AMPLIFIER, 0.2 - 4.0 GHz. Absolute Maximum Ratings. Outline Drawing
该数据表的模型线
文件文字版本
HMC639ST89 / 639ST89E
v03.0810
HIGH IP3, LOW NOISE AMPLIFIER, 0.2 - 4.0 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Volts RF Input Power (RFIN)(Vcc = +5 Vdc) +15 dBm ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Channel Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.86 W (derate 13.3 mW/°C above 85 °C) Thermal Resistance 75.6 °C/W (Channel to lead) Storage Temperature -65 to +150 °C 9 Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A T M
Outline Drawing
R - S E W O R & P A E IN NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. S - L 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. R 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] IE 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. LIF P M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC639ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H639 XXXX HMC639ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H639 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX Inf F or o m rat ip o r n ifc ur e n ,is hd e e d lbiv y e Anry alo a g n D d evi cto es ips la beclie ev eo d rtd o e b r e sa: ccH ur iattte itaen M d reliic a r bl o e w . H a o v weev eC r, o n r o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No Or P d hoe n r e O : 7 n- 81-li 3 n 2 e 9- a 4 t 7 0 www 0 • O . rdh e itt r o it n e li . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
9 - 4
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p p liocra t ia o pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D
v03.0810
HIGH IP3, LOW NOISE AMPLIFIER, 0.2 - 4.0 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Volts RF Input Power (RFIN)(Vcc = +5 Vdc) +15 dBm ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Channel Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.86 W (derate 13.3 mW/°C above 85 °C) Thermal Resistance 75.6 °C/W (Channel to lead) Storage Temperature -65 to +150 °C 9 Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A T M
Outline Drawing
R - S E W O R & P A E IN NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. S - L 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. R 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] IE 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. LIF P M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC639ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H639 XXXX HMC639ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H639 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX Inf F or o m rat ip o r n ifc ur e n ,is hd e e d lbiv y e Anry alo a g n D d evi cto es ips la beclie ev eo d rtd o e b r e sa: ccH ur iattte itaen M d reliic a r bl o e w . H a o v weev eC r, o n r o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No Or P d hoe n r e O : 7 n- 81-li 3 n 2 e 9- a 4 t 7 0 www 0 • O . rdh e itt r o it n e li . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
9 - 4
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p p liocra t ia o pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D