Datasheet HMC1126 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC, Power Amplifier, 2 GHz to 50 GHz |
| 页数 / 页 | 16 / 10 — HMC1126. Data Sheet. –55°C. +25°C. +85°C. Bm). 3 (. FREQUENCY (GHz). … |
| 修订版 | C |
| 文件格式/大小 | PDF / 333 Kb |
| 文件语言 | 英语 |
HMC1126. Data Sheet. –55°C. +25°C. +85°C. Bm). 3 (. FREQUENCY (GHz). 65mA. 2GHz. 80mA. 10GHz. 95mA. 20GHz. 105mA. 30GHz. 40GHz. 50GHz. Bc). POUT/TONE (dBm)
该数据表的模型线
文件文字版本
HMC1126 Data Sheet 35 35 –55°C 4V +25°C 5V 33 +85°C 33 6V 7V 8V 31 31 29 29 27 27 Bm) Bm) d 25 d 25 3 ( 3 ( IP 23 IP 23 21 21 19 19 17 17 15 15 2 6 10 14 18 22 26 30 34 38 42 46 50
015
2 6 10 14 18 22 26 30 34 38 42 46 50
018
FREQUENCY (GHz)
13083-
FREQUENCY (GHz)
13083- Figure 21. Output IP3 vs. Frequency for Various Temperatures, Figure 24. Output IP3 vs. Frequency for Various Supply Voltages, POUT = 0 dBm/Tone POUT = 0 dBm/Tone (For VDD = 4 V, VGG2 = 1.4 V; for VDD = 5 V, VGG2 = 1.4 V; for VDD = 6 V, VGG2 = 2 V; for VDD = 7 V, VGG2 = 3 V; for VDD =8 V, VGG2 = 3.6 V)
35 80 65mA 2GHz 80mA 33 10GHz 95mA 70 20GHz 105mA 30GHz 31 40GHz 60 50GHz 29 50 27 Bm) Bc) d 25 d 40 3 ( 3 ( IP IM 23 30 21 20 19 10 17 15 0 2 6 10 14 18 22 26 30 34 38 42 46 50
016
–5 –2 1 4 7 10
019
FREQUENCY (GHz)
13083-
POUT/TONE (dBm)
13083- Figure 22. Output IP3 vs. Frequency for Various Supply Currents, Figure 25. Output IM3 vs. POUT/Tone at POUT = 0 dBm/Tone (For VDD = 5 V, VGG2 = 1.4 V) VDD = 4 V, VGG2 = 1.4 V
80 80 2GHz 2GHz 10GHz 10GHz 70 20GHz 70 20GHz 30GHz 30GHz 40GHz 40GHz 60 50GHz 60 50GHz 50 50 Bc) d Bc) 40 d 40 3 ( 3 ( IM IM 30 30 20 20 10 10 0 0 –5 –2 1 4 7 10
017
–5 –2 1 4 7 10
020
POUT/TONE (dBm)
13083-
POUT/TONE (dBm)
13083- Figure 23. Output Third-Order Intermodulation (IM3) vs. POUT/Tone at Figure 26. Output IM3 vs. POUT/Tone at VDD = 5 V, VGG2 = 1.4 V VDD = 6 V, VGG2 = 2 V Rev. C | Page 10 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 2 GHz TO 10 GHz FREQUENCY RANGE 10 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
015
2 6 10 14 18 22 26 30 34 38 42 46 50
018
FREQUENCY (GHz)
13083-
FREQUENCY (GHz)
13083- Figure 21. Output IP3 vs. Frequency for Various Temperatures, Figure 24. Output IP3 vs. Frequency for Various Supply Voltages, POUT = 0 dBm/Tone POUT = 0 dBm/Tone (For VDD = 4 V, VGG2 = 1.4 V; for VDD = 5 V, VGG2 = 1.4 V; for VDD = 6 V, VGG2 = 2 V; for VDD = 7 V, VGG2 = 3 V; for VDD =8 V, VGG2 = 3.6 V)
35 80 65mA 2GHz 80mA 33 10GHz 95mA 70 20GHz 105mA 30GHz 31 40GHz 60 50GHz 29 50 27 Bm) Bc) d 25 d 40 3 ( 3 ( IP IM 23 30 21 20 19 10 17 15 0 2 6 10 14 18 22 26 30 34 38 42 46 50
016
–5 –2 1 4 7 10
019
FREQUENCY (GHz)
13083-
POUT/TONE (dBm)
13083- Figure 22. Output IP3 vs. Frequency for Various Supply Currents, Figure 25. Output IM3 vs. POUT/Tone at POUT = 0 dBm/Tone (For VDD = 5 V, VGG2 = 1.4 V) VDD = 4 V, VGG2 = 1.4 V
80 80 2GHz 2GHz 10GHz 10GHz 70 20GHz 70 20GHz 30GHz 30GHz 40GHz 40GHz 60 50GHz 60 50GHz 50 50 Bc) d Bc) 40 d 40 3 ( 3 ( IM IM 30 30 20 20 10 10 0 0 –5 –2 1 4 7 10
017
–5 –2 1 4 7 10
020
POUT/TONE (dBm)
13083-
POUT/TONE (dBm)
13083- Figure 23. Output Third-Order Intermodulation (IM3) vs. POUT/Tone at Figure 26. Output IM3 vs. POUT/Tone at VDD = 5 V, VGG2 = 1.4 V VDD = 6 V, VGG2 = 2 V Rev. C | Page 10 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 2 GHz TO 10 GHz FREQUENCY RANGE 10 GHz TO 26 GHz FREQUENCY RANGE 26 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE