Datasheet AD744 (Analog Devices) - 14

AD744 Data Sheet REFERENCE PLANE 0.50 (12.70) MIN 0.100 (2.54) 0.185 (4.70) 0.250 (6.35) MIN BSC 0.165 (4.19) 0.050 (1.27) MAX 0.160 (4.06) 0.140 (3.56) 5 0.370 (9.40) 6 4 0.021 (0.53) 0.335 (8.51) 0.200 (5.08) 0.016 (0.40) BSC 7 0.045 (1.14) 3 0.335 (8.51) 0.027 (0.69) 0.305 (7.75) 2 8 0.034 (0.86) 1 0.100 (2.54) 0.028 (0.71) 0.019 (0.48) BSC SIDE VIEW BOTTOM VIEW 0.016 (0.41) 0.040 (1.02) MAX 45° BSC 0.040 (1.02) 0.010 (0.25) BASE & SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-002-AK B CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS 15- (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR -20 -15 REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 01
Figure 45. 8-Pin Metal Header [TO_99] (H-08) Dimensions shown in inches and (millimeters]
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD744JR 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744JRZ 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744JR-REEL 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744KRZ 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744KRZ-REEL 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744KRZ-REEL7 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 AD744AQ −40°C to +85°C 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8 AD744BQ −40°C to +85°C 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8 AD744JNZ −40°C to +85°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8 AD744KNZ −40°C to +85°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8 AD744JCHIPS 0°C to +70°C Die AD744TH/883B −55°C to +125°C 8-Pin Metal Header [TO-99] H-08 1 Z = RoHS Compliant Part. Rev. D | Page 14 of 15 Document Outline FEATURES ac Performance dc Performance APPLICATIONS CONNECTION DIAGRAMS PRODUCT DESCRIPTION PRODUCT HIGHLIGHTS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS METALIZATION PHOTOGRAPH TYPICAL CHARACTERISITICS POWER SUPPLY BYPASSING MEASURING AD744 SETTLING TIME EXTERNAL FREQUENCY COMPENSATION Using Decompensation to Extend the Gain Bandwidth Product HIGH-SPEED OP AMP APPLICATIONS TECHNIQUES DAC Buffers (I-to-V Converters) A HIGH-SPEED, 3 OP AMP INSTRUMENTATION AMPLIFIER CIRCUIT Minimizing Settling Time in Real-World Applications OUTLINE DIMENSIONS ORDERING GUIDE REVISION HISTORY