Datasheet STM32WB5MMG (STMicroelectronics) - 31
| 制造商 | STMicroelectronics |
| 描述 | Bluetooth Low Energy 5.0 and 802.15.4 module |
| 页数 / 页 | 31 / 31 — STM32WB5MMG. IMPORTANT NOTICE – PLEASE READ CAREFULLY. DS13252. Rev 1. … |
| 文件格式/大小 | PDF / 3.7 Mb |
| 文件语言 | 英语 |
STM32WB5MMG. IMPORTANT NOTICE – PLEASE READ CAREFULLY. DS13252. Rev 1. page 31/31
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STM32WB5MMG IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved
DS13252
-
Rev 1 page 31/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved
DS13252
-
Rev 1 page 31/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures