Datasheet STM32WB5MMG (STMicroelectronics) - 30
| 制造商 | STMicroelectronics |
| 描述 | Bluetooth Low Energy 5.0 and 802.15.4 module |
| 页数 / 页 | 31 / 30 — STM32WB5MMG. List of figures. Figure 1. Figure 2. Figure 3. Figure 4. … |
| 文件格式/大小 | PDF / 3.7 Mb |
| 文件语言 | 英语 |
STM32WB5MMG. List of figures. Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11
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STM32WB5MMG List of figures List of figures Figure 1.
STM32WB5MMG module block diagram . 3
Figure 2.
STM32WB5MMG module pinout: bottom view . 5
Figure 3.
Reset circuit . 9
Figure 4.
STM32WB5MMG board placement . 10
Figure 5.
Conductive enclosure around the antenna . 11
Figure 6.
STM32WB5MMG ground plane layout . 12
Figure 7.
Sensitive GPIO location . 12
Figure 8.
Reference board schematics . 13
Figure 9.
PCB layout. 14
Figure 10.
Antenna radiation patterns . 16
Figure 11.
Recommended re-flow profile . 18
Figure 12.
SiP-LGA86 - Outline . 19
Figure 13.
SiP-LGA86 marking example . 21
Figure 14.
STM32WB5MMG packing drawing . 23
Figure 15.
CE certification logo . 24
Figure 16.
JRF certification logo . 25
Figure 17.
NCC certification logo . 25
DS13252
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Rev 1 page 30/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
STM32WB5MMG List of figures List of figures Figure 1.
STM32WB5MMG module block diagram . 3
Figure 2.
STM32WB5MMG module pinout: bottom view . 5
Figure 3.
Reset circuit . 9
Figure 4.
STM32WB5MMG board placement . 10
Figure 5.
Conductive enclosure around the antenna . 11
Figure 6.
STM32WB5MMG ground plane layout . 12
Figure 7.
Sensitive GPIO location . 12
Figure 8.
Reference board schematics . 13
Figure 9.
PCB layout. 14
Figure 10.
Antenna radiation patterns . 16
Figure 11.
Recommended re-flow profile . 18
Figure 12.
SiP-LGA86 - Outline . 19
Figure 13.
SiP-LGA86 marking example . 21
Figure 14.
STM32WB5MMG packing drawing . 23
Figure 15.
CE certification logo . 24
Figure 16.
JRF certification logo . 25
Figure 17.
NCC certification logo . 25
DS13252
-
Rev 1 page 30/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures